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US 2025/0144857 A1Published application
Molding system and molding method
AssigneeIntel Corporation
InventorsZhixin XIE, Yi LI, Jesse JONES, Gang DUAN, Andrew JIMENEZ, Jung Kyu HAN, Yekan WANG
Life of this patent
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Abstract
Various aspects may provide a molding system. The molding system may include a molding unit which includes a first mold panel and a second mold panel. The first mold panel and the second mold panel may include a mold cavity which surrounds a semiconductor workpiece along a side surface of the semiconductor workpiece, with the first mold panel and the second mold panel engaged with the semiconductor workpiece. Various aspects may also provide a molding method which utilize the molding system.
Claims20
A system comprising:
- a molding unit comprising:
- a workpiece-holding portion configured to accommodate a semiconductor workpiece,
- a first mold panel comprising a first closed-loop element, the first closed-loop element configured to engage a first peripheral region of a base surface of the semiconductor workpiece, and
- a second mold panel comprising a second closed-loop element, the second closed-loop element configured to engage a second peripheral region of an upper surface of the semiconductor workpiece,
- wherein the first mold panel and the second mold panel comprise a mold cavity configured to surround the semiconductor workpiece along a side surface of the semiconductor workpiece, with the first closed-loop element and the second closed-loop element, respectively, engaged with the first peripheral region and the second peripheral region of the semiconductor workpiece.
2 more elements
A system comprising:
- a molding unit comprising:
- a plurality of workpiece-holding portions configured to accommodate a plurality of semiconductor workpieces,
- a first mold panel comprising a plurality of first closed-loop elements, and
- a second mold panel comprising a plurality of second closed-loop elements,
- wherein the first mold panel and the second mold panel are configured to form a plurality of interconnected mold cavities,
- wherein each mold cavity, of the plurality of interconnected mold cavities, is configured to surround a respective semiconductor workpiece along a side surface of the semiconductor workpiece, with a respective first closed-loop element engaged with a first peripheral region of a base surface of the semiconductor workpiece and a respective second closed-loop element engaged with a second peripheral region of an upper surface of the semiconductor workpiece.
3 more elements
A method comprising:
- providing a molding unit comprising a first mold panel and a second mold panel, wherein the first mold panel comprises a first closed-loop element and the second mold panel comprises a second closed-loop element;
- disposing a semiconductor workpiece within a workpiece-holding portion of the molding unit;
- engaging a first peripheral region of a base surface of the semiconductor workpiece with the first closed-loop element of the first mold panel and engaging a second peripheral region of an upper surface of the semiconductor workpiece with the second closed-loop element of the second mold panel, such that the first mold panel and the second mold panel forms a mold cavity surrounding the semiconductor workpiece along a side surface of the semiconductor workpiece;
- and
- delivering a mold material into the mold cavity.
2 more elements
Dependencies are inferred from the claim text.