Back to results
US 2025/0144846 A1Published application
Method for detaching substrates bonded by polyurethane adhesive
AssigneeHenkel AG & Co. KGaA
InventorsGwanghyun Park, Arnold Yeonwoo Nam
Life of this patent
Estimating the term…
Abstract
Method for detaching two substrates bonded by a polyurethane adhesive, comprising the steps of: (1) treating a first substrate and a second substrate bonded by a polyurethane adhesive with a debonding agent comprising lactic acid at a temperature from 40° C. to 90° C., and (2) separating the first substrate and the second substrate from the polyurethane adhesive.
Claims18
A method for detaching two substrates bonded by a polyurethane adhesive, comprising the steps of:
- (1) treating a first substrate and a second substrate bonded by a polyurethane adhesive with a debonding agent comprising lactic acid at a temperature from 40° C. to 90° C., and
- (2) separating the first substrate and the second substrate from the polyurethane adhesive.
(canceled)
A method of recycling a shoe including a first substrate bonded to a second substrate by a cured polyurethane adhesive, comprising:
- providing the shoe to be recycled;
- treating the shoe to be recycled with a debonding agent comprising lactic acid at a temperature from 40° C. to 90° C., and
- separating the first substrate from the second substrate.
Dependencies are inferred from the claim text.