Brush aging pad, chemical mechanical polishing cleaning apparatus, and brush aging method
AssigneeSamsung Electronics Co., Ltd.
InventorsHeesung KIM, Kangin KIM, Dongwoo LEE
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Abstract
Provided is a brush aging pad configured to age a surface protrusion of a brush configured to clean a semiconductor wafer in a chemical mechanical polishing cleaning apparatus, the brush aging pad including a pad body, wherein a roughness of at least one surface of the pad body ranges from 1 μm to 5 μm.
Claims21
A brush aging pad configured to age a surface protrusion of a brush configured to clean a semiconductor wafer in a chemical mechanical polishing cleaning apparatus, the brush aging pad comprising:
- a pad body,
- wherein a surface roughness of at least one surface of the pad body ranges from 1 μm to 5 μm.
A chemical mechanical polishing apparatus comprising:
- a brush aging chamber configured to accommodate a pair of brushes;
- and
- a brush aging pad between the pair of brushes included in the brush aging chamber, the brush aging pad configured to age a surface protrusion of the brush,
- wherein the brush aging pad comprises a pad body, a surface roughness of at least one surface of the pad body ranging from 1 μm to 5 μm.
A chemical mechanical polishing apparatus comprising:
- a brush aging chamber configured to accommodate a brush;
- and
- a brush aging pad configured to be in contact with and to be pressed against a surface protrusion of the brush included in the brush aging chamber,
- wherein the brush aging pad comprises a pad body having circular shape, a surface roughness of at least one surface of the pad body ranging from 1 μm to 5 μm.
21-27. (canceled)
Dependencies are inferred from the claim text.