Polishing pad, method for producing polishing pad, and method for polishing surface of optical material or semiconductor material

Abstract

An object of the present invention is to provide a polishing pad that uses a polyol different from conventionally used polyols such as PTMG as a high molecular weight polyol of an isocyanate-terminated urethane prepolymer that forms a polishing layer, a method for producing the polishing pad, and a method for polishing the surface of an optical material or a semiconductor material using the polishing pad. A polishing pad having a polishing layer comprising a polyurethane resin, wherein the polyurethane resin is a cured product of a curable resin composition comprising an isocyanate-terminated urethane prepolymer and a curing agent, and the isocyanate-terminated urethane prepolymer is a reaction product of a polyol component and a polyisocyanate component, and the polyol component comprises a polyol having a carbonate group in a molecule.

Dependencies are inferred from the claim text.