# US 2025/0144747 A1 · Method of manufacturing substrate

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- Number: US 2025/0144747 A1
- Document ID: US20250144747A1
- Status: Published application
- Kind: A1
- Application number: 18/926,654
- Filed: 2024-10-25
- Published: 2025-05-08
- Earliest claimed: 2023-11-06
- Assignees: Disco Corporation
- Applicants: Disco Corporation
- Inventors: Yuya SETO
- Web page: https://patentgrep.com/patent/US20250144747A1

## CPC

- B23K 26/53: for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
- B23K 26/0622: by shaping pulses
- H10P 52/00: Grinding, lapping or polishing of wafers, substrates or parts of devices
- B23K 2101/40: Semiconductor devices
- B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

A method of manufacturing a substrate from a workpiece includes a separation layer forming step of moving the workpiece and a focused spot of a laser beam having a wavelength transmittable through the gallium oxide and a repetitively pulsed power output relatively to each other perpendicularly to thicknesswise directions of the workpiece while positioning the focused spot within the workpiece, thereby forming in the workpiece a separation layer including a plurality of modified regions arrayed in a direction along which the focused spot travels in the workpiece and cracks developed from each of the modified regions, and after the separation layer forming step, a cleaving step of cleaving the workpiece along the separation layer, thereby manufacturing the substrate from the workpiece.

## Claims

### Claim 1

A method of manufacturing a substrate from a workpiece made of gallium oxide such that the substrate is thinner than the workpiece, the method comprising:
a separation layer forming step of moving the workpiece and a focused spot of a laser beam having a wavelength transmittable through the gallium oxide and a repetitively pulsed power output relatively to each other perpendicularly to thicknesswise directions of the workpiece while positioning the focused spot within the workpiece, thereby forming in the workpiece a separation layer including a plurality of modified regions arrayed in a direction along which the focused spot travels in the workpiece and cracks developed from each of the plurality of modified regions; and
after the separation layer forming step, a cleaving step of cleaving the workpiece along the separation layer, thereby manufacturing the substrate from the workpiece, wherein
a value calculated by dividing a center-to-center spacing of an adjacent pair of modified regions in the direction along which the focused spot travels among the plurality of modified regions by a length of modified region of each of the adjacent pair in the direction along which the focused spot travels is in a range of 1.63 to 2.73.

### Claim 2 (depends on 1)

The method of manufacturing a substrate according to claim 1, wherein the value is in the range of 1.94 to 2.43.

### Claim 3 (depends on 1)

The method of manufacturing a substrate according to claim 1, wherein the value is in the range of 2.11 to 2.33.

### Claim 4 (depends on 1)

The method of manufacturing a substrate according to claim 1, further comprising:
a preliminary modified region forming step of forming a preliminary modified region in the workpiece by applying to the workpiece a laser beam having a same pulsed energy as the laser beam applied to the workpiece in the separation layer forming step while positioning a focused spot of the laser beam within the workpiece; and
after the preliminary modified region forming step but before the separation layer forming step, a measuring step of measuring a reference length of preliminary modified region in the direction along which the focused spot travels, wherein
conditions for applying the laser beam to the workpiece in the separation layer forming step are established such that the center-to-center spacing is in the range of 1.63 to 2.73 times the reference length of preliminary modified region.