Display device and method of fabricating the same

A display device comprising:

• a substrate comprising a first emission area comprising a first emission portion and a second emission portion, and a second emission area spaced apart from the second emission portion with the first emission portion disposed between the second emission area and the second emission portion;
• a first light-emitting member disposed on the substrate and comprising:
• a first light-emitting element overlapping the first emission portion,
• a second light-emitting element overlapping the second emission area, and
• a bank member overlapping the second emission portion;
• a first encapsulation layer disposed on the first light-emitting member;
• and
• a second light-emitting member disposed on the first encapsulation layer and comprising a third light-emitting element overlapping the second emission portion, wherein
• the bank member comprises:
• a first portion in contact with the first light-emitting element,
• a second portion in contact with the third light-emitting element, and
• a third portion in contact with the second light-emitting element, and
• the first portion, the second portion and the third portion are spaced apart from one another with the first encapsulation layer disposed between the first portion, the second portion and the third portion.

A method of fabricating a display device, the method comprising:

• preparing a substrate comprising:
• an emission area comprising a first emission portion and a second emission portion, and
• a non-emission area disposed between the first emission portion and the second emission portion;
• forming a first electrode disposed on the first emission portion of the substrate and a sacrificial layer disposed on the first electrode, and forming a first pixel-defining material layer that covers the sacrificial layer and exposes a part of the first electrode;
• forming a first bank material layer covering the first electrode and the first pixel-defining material layer, and a second bank material layer disposed on the first bank material layer, and removing the first bank material layer and the second bank material layer and a part of the first pixel-defining material layer by an etching process to form first and second holes overlapping the first electrode and spaced apart from each other;
• partially etching an inside of the first hole by an etching process to form a first bank layer and a second bank layer having a tip portion protruding from the first bank layer toward the first emission portion, and forming a first pixel-defining layer defining a first opening;
• forming a first display emissive layer and a second electrode disposed on the first electrode such that the first display emissive layer and the second electrode are in contact with a side surface of the first bank layer in the first emission portion, and forming a first thin-film encapsulation layer covering the second electrode, the first bank layer and the second bank layer;
• removing a part of the first thin-film encapsulation layer by an etching process in the second emission portion to expose a part of the second bank layer in the second emission portion;
• forming a third electrode disposed on the second bank layer and the first thin-film encapsulation layer and a sacrificial layer disposed on the third electrode in the second emission portion, and a second pixel-defining layer cover a part of the sacrificial layer and defining a second opening in the first emission portion;
• removing the sacrificial layer disposed on the third electrode by an etching process using the second pixel-defining layer as a mask, forming a second display emissive layer disposed on the third electrode, and then a common electrode entirely covering the second display emissive layer and the second pixel-defining layer;
• and
• forming a second thin-film encapsulation layer disposed on the common electrode,
• wherein the forming of the third electrode comprises disposing the third electrode to contact the second bank layer.