Semiconductor structure and method for forming the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsJEN-YUAN CHANG, CHIA-PING LAI
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Abstract
A semiconductor structure and a method for forming the semiconductor structure are disclosed. The semiconductor structure includes a first die including a fuse structure in a topmost layer of the first die, the fuse structure including a pair of conductive segments, wherein one of the pair of conductive segments is electrically connected to a bonding pad of the first die, wherein the bonding pad is electrically connected to ground; and an inductor electrically connected to the one of the pair of conductive segments.
Claims20
A semiconductor structure comprising:
- a first die comprising a fuse structure in a topmost layer of the first die, the fuse structure including a pair of conductive segments, wherein one of the pair of conductive segments is electrically connected to a bonding pad of the first die, wherein the bonding pad is electrically connected to ground;
- and
- an inductor electrically connected to the one of the pair of conductive segments.
A semiconductor structure comprising:
- a first integrated circuit component comprising a bonding layer including a fuse structure, the fuse structure being in a blown state;
- a second integrated circuit component bonded to the bonding layer, the second integrated circuit component comprising an inductor electrically connected to the fuse structure;
- and
- a third integrated circuit component bonded to the second integrated circuit component.
A semiconductor structure comprising:
- a first integrated circuit component comprising a first fuse structure and a seal ring electrically coupled to the first fuse structure;
- a second integrated circuit component arranged over the first integrated circuit component and comprising an inductor;
- and
- a third integrated circuit component arranged over and bonded to the second integrated circuit component.
Dependencies are inferred from the claim text.