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US 2025/0138422 A1Published application
Photosensitive resin composition, manufacturing method of electronic device, and electronic device
AssigneeSumitomo Bakelite Co., Ltd.
InventorsTakuji KAWANAMI, Yuma TANAKA, Ritsuya KAWASAKI
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Abstract
Provided is a photosensitive resin composition containing a polyamide resin and/or a polyimide resin, in which, in a case where a cured film obtained by heating the photosensitive resin composition at 170° C. for 2 hours is subjected to a dynamic viscoelasticity measurement under the following conditions, a storage elastic modulus E′220 at 220° C. is 0.5 to 3.0 GPa. [Conditions] Frequency: 1 Hz, Temperature: 30° C. to 300° C., heating rate: 5° C./min, Measurement mode: tensile mode
Claims13
A photosensitive resin composition comprising:
- a polyamide resin and/or a polyimide resin,
- wherein, in a case where a cured film obtained by heating the photosensitive resin composition at 170° C. for 2 hours is subjected to a dynamic viscoelasticity measurement under the following conditions, a storage elastic modulus E′220 at 220° C. is 0.5 to 3.0 GPa,
- [conditions]
- frequency:
- 1 Hz,
- temperature:
- 30° C. to 300° C.,
- heating rate:
- 5° C./min,
- measurement mode:
- tensile mode.
8 more elements
Dependencies are inferred from the claim text.