Spin chuck and substrate processing apparatus including the same

A substrate processing apparatus comprising:

• a spin chuck configured to support a substrate and to rotate around an axis extending along a vertical direction;
• an inverter configured to load the substrate onto an upper surface of the spin chuck or unload the substrate from the upper surface of the spin chuck;
• and
• a first nozzle circuit configured to eject processing fluid toward the substrate on the upper surface of the spin chuck,
• wherein the spin chuck comprises:
• an upper plate having an upper surface and a lower surface, the upper plate comprising a groove, wherein the substrate is on the upper surface of the upper plate;
• an anti-slip plate below the upper plate, the anti-slip plate having an upper surface and a lower surface, the anti-slip plate comprising:
• a first protrusion protruding in the vertical direction from the upper surface of the anti-slip plate toward the upper plate, and
• a ring wing;
• and
• a lower plate below the anti-slip plate, the lower plate comprising a chucking pin configured to fix the substrate, wherein the lower plate has an upper surface and a lower surface, and
• wherein the first protrusion of the anti-slip plate is coupled to the groove of the upper plate.

A substrate processing apparatus comprising:

• a spin chuck configured to support a substrate and to rotate around a first axis extending along about a vertical direction;
• an inverter configured to fix the substrate, the inverter comprising a hand configured to reverse the substrate 180 degrees and a support coupled to the hand and having a shape extending in the vertical direction;
• and
• a first nozzle circuit comprising a nozzle configured to eject processing fluid toward the substrate on an upper surface of the spin chuck, a nozzle arm on which the nozzle is mounted, and a support rod configured to support the nozzle arm and to rotate around a second axis extending along the vertical direction,
• wherein the spin chuck comprises:
• an upper plate having an upper surface and a lower surface, the upper plate comprising a groove, wherein a substrate is on the upper surface of the upper plate;
• an anti-slip plate below the upper plate, the anti-slip plate having an upper surface and a lower surface, the anti-slip plate comprising:
• a first protrusion protruding in the vertical direction from the upper surface of the anti-slip plate toward the upper plate, and
• a ring wing;
• and
• a lower plate below the anti-slip plate, the lower plate comprising a chucking pin configured to fix the substrate, wherein the lower plate has an upper surface and a lower surface,
• wherein the first protrusion of the anti-slip plate is coupled to the groove of the upper plate,
• wherein a vertically protruding pattern is on at least one of the upper surface and the lower surface of the anti-slip plate,
• wherein a diameter of the anti-slip plate is in a range of about 240 mm to about 300 mm,
• wherein a thickness of the ring wing in the vertical direction is in a range of about 1 mm to about 3 mm,
• wherein one side surface of the ring wing comes into contact with a side surface of the lower plate, and another side surface of the ring wing comes into contact with the chucking pin, and
• wherein a shape of the first protrusion is identical to a shape of the groove.