Resin composition, prepreg, film with resin, sheet of metal foil with resin, metal-clad laminate, and printed wiring board

A resin composition containing:

• a curable resin (A);
• an acrylic-monomer copolymer (B) having a structure expressed by the following formulae (1), (2), and (3) and having a weight average molecular weight equal to or greater than 10,000 and equal to or less than 900,000:
• an inorganic filler (C), where a molybdenum compound is present on at least a part of a surface of the inorganic filler (C);
• and
• another inorganic filler (D) different from the inorganic filler (C),
• wherein x, y, and z in the formulae (1) to (3) represent mole fractions and satisfy x+y+z≤1, 0<x≤0.2, 0.6≤y≤0.95, and 0.05≤z≤0.2,
• in the formula (2), R1 is either a hydrogen atom or a methyl group, and R2 includes at least one of a glycidyl group or an epoxidized alkyl group which is selected from the group consisting of a hydrogen atom, an alkyl group, the glycidyl group, and the epoxidized alkyl group, and
• in the formula (3), R3 is either a hydrogen atom or a methyl group, and R4 is Ph (phenyl group), —COOCH2Ph, or —COO(CH2)2Ph.