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US 2025/0129212 A1Published application
Porous film and copper clad laminate
AssigneeIndustrial Technology Research Institute
InventorsLi-Ting HUANG, Tzong-Ming LEE
Life of this patent
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Abstract
A porous film is formed by reacting polyamic acid and multi-isocyanate, and the polyamic acid is formed by reacting 1 to 20 parts by mole of (a1) first diamine having a hydroxyl group, 80 to 99 parts by mole of (a2) second diamine without any hydroxyl group, and 100 parts by mole of (b) dianhydride. The multi-isocyanate and (b) dianhydride have a molar ratio of 0.25:100 to 20:100. The porous film has an average pore size of 500 nm to 2000 nm.
Claims10
A porous film, being formed by reacting polyamic acid and multi-isocyanate, and the polyamic acid is formed by reacting
- 1 to 20 parts by mole of (a1) first diamine having a hydroxyl group;
- 80 to 99 parts by mole of (a2) second diamine without any hydroxyl group;
- and
- 100 parts by mole of (b) dianhydride,
- wherein the multi-isocyanate and (b) dianhydride have a molar ratio of 0.25:100 to 20:100, and
- wherein the porous film has an average pore size of 500 nm to 2000 nm.
3 more elements
Dependencies are inferred from the claim text.