Microelectromechanical sensing device and manufacturing method thereof

A manufacturing method of a microelectromechanical sensing device, comprising:

• forming a sacrificial layer on a substrate;
• forming a first dielectric layer on the sacrificial layer;
• embedding a plurality of support structures into the sacrificial layer and the first dielectric layer to make a support bottom surface of each of the plurality of support structures connected to the substrate and make a support top surface of each of the plurality of support structures coplanar with a dielectric top surface of the first dielectric layer, wherein the support bottom surface and the support top surface are respectively located at two opposite ends;
• forming an electrode layer and a sensing layer on the first dielectric layer, wherein the electrode layer directly contacts the plurality of support structures, and a projection of the sensing layer toward the substrate does not overlap the plurality of support structures;
• forming a second dielectric layer on the electrode layer and the sensing layer, wherein the second dielectric layer and the first dielectric layer are made of a same material;
• and
• forming an opening at the first dielectric layer, the electrode layer and the second dielectric layer to release the sacrificial layer.