Monitoring apparatus for package
AssigneesSamsung Electronics Co., Ltd., Samsung Semiconductor China Research & Development Co., LTD.
InventorMinyan WU
Life of this patent
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Abstract
A monitoring apparatus for a package includes a pressure applying device configured to apply a pressure to the package, a sensor configured to measure the pressure applied to the package by the pressure applying device, and a signal transmitting apparatus electrically coupled to the package and configured to input an input signal to a chip of the package, receive an output signal from the package in real time, and monitor a damage of the chip of the package in real time while the pressure applying device applies the pressure to the package.
Claims10
A monitoring apparatus for a package, comprising:
- a pressure applying device configured to apply a pressure to the package;
- a sensor configured to measure the pressure applied to the package by the pressure applying device;
- and
- a signal transmitting apparatus electrically coupled to the package and configured to:
- input an input signal to a chip of the package;
- receive an output signal from the package in real time;
- and
- monitor a damage of the chip of the package in real time while the pressure applying device applies the pressure to the package.
Dependencies are inferred from the claim text.