Curable resin, curable resin composition, and cured article
AssigneeDIC Corporation
InventorsRyuichi Matsuoka, Lichen Yang, Hiroyoshi Kannari
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AssigneeDIC Corporation
InventorsRyuichi Matsuoka, Lichen Yang, Hiroyoshi Kannari
Estimating the term…
An object of the present invention is to provide a curable resin composition having excellent solvent solubility, heat resistance (high glass transition temperature), and dielectric properties (low dielectric properties), and a cured article thereof. Specifically, the curable resin composition includes a curable resin (A) that has a repeating unit represented by General Formula (1) and contains one or more reactive groups selected from the group consisting of a (meth)acryloyloxy group, a vinylbenzyl ether group, and an allyl ether group as a terminal structure, and a curable compound (B) represented by General Formula (2). The details of the substituent represented by General Formula (1) and the number of substituents are as described in the specification. The details of the substituent represented by General Formula (2) and the number of substituents are as described in the specification.
A curable resin composition comprising:
(canceled)
Dependencies are inferred from the claim text.