Substrate processing apparatus

A substrate processing apparatus comprising:

• a process chamber configured to provide a reaction space in which a substrate is processed;
• a first injection plate disposed within the process chamber and including a plurality of protruding nozzles facing and protruding toward the substrate;
• and
• a second injection plate disposed within the process chamber and provided with a plurality of insertion holes into which the protruding nozzles are inserted,
• wherein the second injection plate has a central area, a peripheral area surrounding the central area, and an edge area surrounding the peripheral area, and
• wherein the protruding nozzles are inserted into the insertion holes so as to be further spaced apart from centers of the insertion holes along a direction to which the second injection plate extends in directions from the central area to the edge area.

A substrate processing apparatus comprising:

• a process chamber configured to provide a reaction space in which a substrate is processed;
• a first injection plate disposed within the process chamber and including a plurality of protruding nozzles facing and protruding toward the substrate;
• and
• a second injection plate disposed within the process chamber and provided with a plurality of insertion holes into which the protruding nozzles are inserted,
• wherein the second injection plate has a central area, a peripheral area surrounding the central area, and an edge area surrounding the peripheral area, and
• wherein shortest distances between outer circumferential surfaces of the protruding nozzles and inner circumferential surfaces of the insertion holes decrease along a direction to which the second injection plate extends in directions from the central area to the edge area of the second injection plate.