Fusion bonding wafer, tube fusion bonding device, and tube fusion bonding method
AssigneesTerumo Kabushiki Kaisha, Terumo BCT, Inc.
InventorsFilip PAEPS, Maarten Roelandt, Joachim Bortels, Lucas Vandekerckhove
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Abstract
A fusion bonding wafer includes a first substrate formed in a flat plate shape, a second substrate joined to an inner surface of the first substrate, a heating element formed between the inner surface of the first substrate and an inner surface of the second substrate, and a temperature measurement hole that penetrates through the second substrate in a thickness direction thereof and exposes the inner surface of the first substrate.
Claims20
A fusion bonding wafer configured to fusion bond two resin tubes together, the fusion bonding wafer comprising:
- a first substrate formed in a flat plate shape;
- a second substrate joined to an inner surface of the first substrate;
- a heating element disposed between the inner surface of the first substrate and an inner surface of the second substrate;
- and
- a temperature measurement hole that penetrates through the second substrate in a thickness direction thereof and is configured to expose the inner surface of the first substrate.
A tube fusion bonding device configured to cut two resin tubes and fusion bond the two resin tubes together, the tube fusion bonding device comprising:
- a pair of clamps configured to retain the two resin tubes;
- a fusion bonding wafer configured to be inserted between the pair of clamps, the fusion bonding wafer including
- a first substrate formed in a flat plate shape,
- a second substrate joined to an inner surface of the first substrate,
- a heating element disposed between the inner surface of the first substrate and an inner surface of the second substrate, and
- a temperature measurement hole that penetrates through the second substrate in a thickness direction thereof and is configured to expose the inner surface of the first substrate;
- a temperature sensor configured to detect a temperature of the fusion bonding wafer;
- a clamp driving unit configured to cause at least one of the pair of clamps to be moved;
- a wafer driving unit configured to cause the fusion bonding wafer to be moved;
- and
- a controller configured to control operations of the clamp driving unit and the wafer driving unit,
- wherein the temperature sensor is configured to detect a temperature of the inner surface of the first substrate through the temperature measurement hole.
A tube fusion bonding method for fusion bonding two resin tubes together using a fusion bonding wafer, the method comprising:
- retaining two resin tubes by a pair of clamps;
- detecting a temperature of the fusion bonding wafer by a temperature sensor through the temperature measurement hole;
- pressing the fusion bonding wafer, by a wafer driving unit, into the two resin tubes retained by the pair of clamps to cut the two resin tubes in response to a temperature of the inner surface of the first substrate reaching a predetermined temperature;
- and
- fusion bonding the cut two resin tubes to each other,
- wherein the fusion bonding wafer includes
- a first substrate formed in a flat plate shape,
- a second substrate joined to an inner surface of the first substrate,
- a heating element disposed between the inner surface of the first substrate and an inner surface of the second substrate, and
- a temperature measurement hole that penetrates through the second substrate in a thickness direction thereof and is configured to expose the inner surface of the first substrate.
Dependencies are inferred from the claim text.