Resistor mounting structure

A resistor mounting structure comprising:

• a substrate;
• a conductive portion supported by the substrate;
• a resistor arranged on a path through which a current flows in the conductive portion;
• and
• a detection wiring portion electrically connected to the resistor,
• wherein the substrate includes a first obverse surface facing a first side in a thickness direction,
• the conductive portion includes a first conductive portion and a second conductive portion each arranged on the first obverse surface,
• the first conductive portion includes a first pad portion arranged on a first side in a first direction perpendicular to the thickness direction,
• the second conductive portion includes a second pad portion offset from the first pad portion to a second side in the first direction,
• the resistor includes a first portion overlapping with the first pad portion as viewed in the thickness direction, and a second portion overlapping with the second pad portion as viewed in the thickness direction,
• the first pad portion includes a first pad obverse surface facing the first side in the thickness direction,
• the second pad portion includes a second pad obverse surface facing the first side in the thickness direction,
• the resistor mounting structure further includes a first conductive bonding member interposed between the first pad obverse surface and the first portion to bond the first pad obverse surface and the first portion, and a second conductive bonding member interposed between the second pad obverse surface and the second portion to bond the second pad obverse surface and the second portion,
• the detection wiring portion includes a first detection wiring electrically connected to the first pad portion, and a second detection wiring electrically connected to the second pad portion,
• the first detection wiring includes a first wiring obverse surface facing the first side in the thickness direction,
• the second detection wiring includes a second wiring obverse surface facing the first side in the thickness direction,
• the first wiring obverse surface is offset to a second side in the thickness direction relative to the first pad obverse surface, and
• the second wiring obverse surface is offset to the second side in the thickness direction relative to the second pad obverse surface.