US 2025/0109978 A1 · WEIGHT AND/OR LAYER THICKNESS MEASURING EQUIPMENT AND SUBSTRATE PROCESSING SYSTEMS AND METHODS INCLUDING SUCH EQUIPMENT

Abstract

Weight and/or layer thickness measurement systems include: (a) a support base for supporting an object; (b) an oscillator source applying oscillating frequency to the support base; (c) a strain sensor measuring strain induced in the support base by the oscillation; and (d) a phase locked loop module connected to the oscillator source and strain sensor. The oscillating frequency applied to the support base is modified based on phase difference information determined by the phase locked loop module to locate a resonant frequency for the support base and supported object. The resonant frequencies before and after processing are used to determine weight and/or thickness of a layer on the object. Cluster type substrate processing systems may include weight and/or layer thickness measurement systems, e.g., of these types, within a substrate handling chamber and/or in a separate chamber or station engaged with the substrate handling chamber.

Claims31

Dependent claims

A weight and/or layer thickness measurement system, comprising:

a support base including a support surface for supporting an object to be weighed;
an oscillator source configured to apply an oscillating frequency to the support base;
a strain sensor configured to measure strain induced in the support base by the oscillator source;
and
a phase locked loop module connected to the oscillator source and the strain sensor, wherein the oscillating frequency applied by the oscillator source to the support base is modified based on phase difference information determined by the phase locked loop module to locate a resonant frequency for the support base and any object supported by the support base.

2 more elements

A substrate processing system, comprising:

a first substrate handling chamber including a first plurality of component mounting regions, the first plurality of component mounting regions including:
(a) a first load-lock module mounting region configured to engage a first load-lock module and through which incoming substrates for processing are received and outgoing substrates that have been processed are discharged, (b) a second load-lock module mounting region, (c) a first plurality of substrate processing chamber mounting regions, and (d) a metrology station mounting region;
a load-lock module connected with the second load-lock module mounting region;
a second substrate handling chamber including a second plurality of component mounting regions, the second plurality of component mounting regions including:
(a) a third load-lock module mounting region engaged with the load-lock module and (b) a second plurality of substrate processing chamber mounting regions;
and
a metrology station connected with the metrology station mounting region, the metrology station configured to measure at least one of weight of a substrate, weight of a layer on a substrate, or layer thickness on a substrate.

4 more elements

A substrate processing system, comprising:

a first substrate handling chamber including:
(a) a first facet configured to receive incoming substrates for processing and for discharging substrates that have been processed,
(b) a second facet extending at an oblique angle with respect to the first facet, the second facet being configured to engage a first substrate processing chamber,
(c) a third facet extending at an oblique angle with respect to the first facet, the third facet being configured to engage a second substrate processing chamber,
(d) a fourth facet extending at an oblique angle with respect to the second facet,
(e) a fifth facet extending at an oblique angle with respect to the third facet, and
(f) a sixth facet connected between the fourth facet and the fifth facet;
a load-lock module connected with the sixth facet;
a second substrate handling chamber including:
(a) a seventh facet connected with the load-lock module,
(b) an eighth facet extending at an oblique angle with respect to the seventh facet, the eighth facet being configured to engage a third substrate processing chamber,
(c) a ninth facet extending at an oblique angle with respect to the seventh facet, the ninth facet being configured to engage a fourth substrate processing chamber,
(d) a tenth facet extending at an oblique angle with respect to the eighth facet, the tenth facet being configured to engage a fifth substrate processing chamber, and
(e) an eleventh facet extending at an oblique angle with respect to the ninth facet, the eleventh facet being configured to engage a sixth substrate processing chamber,
wherein the load-lock module includes one or more substrate supports for holding substrates being transferred between the first substrate handling chamber and the second substrate handling chamber through the sixth facet and the seventh facet;
and
a metrology station for measuring at least one of weight of a substrate, weight of a layer on a substrate, or layer thickness on a substrate, wherein the metrology station is attached to one of the fourth facet or the fifth facet.

14 more elements

A substrate processing system, comprising:

a first substrate handling chamber including an interior chamber and a first robotic arm mounted within the interior chamber;
a first substrate processing chamber coupled with the first substrate handling chamber via a first gate valve, wherein a portion of the first robotic arm is configured to extend through the first gate valve and into the first substrate processing chamber to move substrates into and out of the first substrate processing chamber;
and
a weight and/or layer thickness measurement system located within the interior chamber.

1 more element

A method of determining weight and/or thickness of a layer on a substrate, comprising:

placing a substrate on a support surface of a support base;
applying oscillating frequency to the support base with the substrate supported thereon;
adjusting the oscillating frequency applied to the support base to locate a first resonant frequency for the support base with the substrate supported on the support surface;
processing the substrate to add a material layer to the substrate or to remove material from a layer on the substrate to thereby form a processed substrate;
placing the processed substrate on the support surface of the support base;
applying oscillating frequency to the support base with the processed substrate supported thereon;
adjusting the oscillating frequency applied to the support base to locate a second resonant frequency for the support base with the processed substrate supported thereon;
and
determining at least one of a weight or a thickness of a layer on the processed substrate based on the second resonant frequency and the first resonant frequency.

6 more elements

Dependencies are inferred from the claim text.

Weight and/or layer thickness measuring equipment and substrate processing systems and methods including such equipment

Life of this patent

Weight and/or layer thickness measuring equipment and substrate processing systems and methods including such equipment

Life of this patent

Abstract

Claims31