Low-dielectric-constant polymer substrate and manufacturing method therefor
AssigneeKorea Institute of Materials Science
InventorsSung-hoon JUNG, Do-geun KIM, Seung-hoon LEE, Joo-young PARK, Eun-yeon BYEON, Jun-yeong YANG
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Abstract
The present disclosure provides a low dielectric polymer substrate and a preparation method thereof. More specifically, the present disclosure provides a low dielectric polymer substrate to which metal or ceramic may be deposited with high adhesion without a separate adhesive layer through surface modification of a polymer substrate and a preparation method thereof.
Claims16
A low dielectric polymer substrate comprising a low dielectric polymer layer;
- a surface modified layer formed by ion beam pretreatment of surface of the polymer layer;
- and a metal or ceramic coated layer optionally formed on the surface modified layer, wherein a water contact angle of the surface modified layer is 90° or less.
A preparation method of a low dielectric polymer substrate comprising ion beam pretreating for surface modification of a surface of a low dielectric polymer layer;
- and optionally forming a metal or ceramic coated layer on the polymer layer, wherein ion beam energy of the ion beam pretreating is 50 to 2000 eV.
Dependencies are inferred from the claim text.