Back to results
US 2025/0109233 A1Published application
Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsYasunori HOSHINO, Mikio SATO, Yuki KITAI
Life of this patent
Estimating the term…
Abstract
An aspect of the present invention relates to a resin composition containing a radical polymerizable compound (A), an inorganic filler (B) containing boron nitride (B-1) and silica (B-2), and a free radical compound (C) having at least one free radical group selected from the group consisting of structures represented by Formulas (1), (2), (3) and (4) in the molecule.
Claims18
A resin composition comprising:
- a radical polymerizable compound (A);
- an inorganic filler (B) containing boron nitride (B-1) and silica (B-2);
- and
- a free radical compound (C) having at least one free radical group selected from the group consisting of structures represented by the following Formulas (1), (2), (3) and (4) in a molecule.
1 more element
Dependencies are inferred from the claim text.