Plant-based substrate, applications and method of fabricating thereof

Abstract

Disclosed herein is a conductive composite material, comprising a pollen-based substrate layer, an elastomeric adhesive layer on top of the pollen-based substrate layer, a biocompatible polymer substrate layer on top of the elastomeric adhesive layer, and a metal layer on top of the biocompatible polymer substrate layer and a method of forming the same. Also disclosed herein is a stretchable biopolymer-based heating pad comprising a pollen-based substrate layer, a cured polymeric layer or a metal layer on top of the pollen-based substrate layer, where, when present, the cured polymeric layer comprises a cured polymeric material and a metal, an encapsulation coating comprising a polymeric material that encapsulates the cured polymeric layer or the metal layer, wherein the pollen-based substrate layer and the cured polymeric layer are patterned to provide a heating pad and the method of forming the same.

Dependencies are inferred from the claim text.