Circuit board and method of manufacturing the same

A method of manufacturing a circuit board, comprising:

• providing an initial substrate;
• performing a first perforating process on the initial substrate to form a pair of openings, a dielectric layer between the pair of the openings, and a substrate physically connected to the dielectric layer, wherein the dielectric layer has a pair of side surfaces facing the pair of the openings and opposite to each other;
• forming a conductive layer on the substrate, on the dielectric layer and in the pair of the openings;
• forming a mask on the conductive layer, wherein the mask at least shields the pair of the openings;
• etching the conductive layer by using the mask to expose the dielectric layer and the substrate and remaining the conductive layer in the pair of the openings;
• after etching the conductive layer by using the mask, removing the mask;
• and
• after removing the mask, remaining a part of the conductive layer on the pair of the side surfaces of the dielectric layer and removing other part of the conductive layer outside the pair of the side surfaces in the pair of the openings.