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US 2025/0102209 A1Published application
Pressure relief arrangement in refrigerant circuits
AssigneeHanon Systems
InventorPeter Heyl
Life of this patent
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Abstract
A pressure relief arrangement in refrigerant circuits with one high-pressure side and one low-pressure side, which is characterized in that the high-pressure side is fluidically connected with the low-pressure side of the refrigerant circuit via an overpressure relief device, wherein the overpressure relief device causes pressure reduction of the overpressure in the case of overpressure on the high-pressure side and fluid flows from the high-pressure side to the low-pressure side of the refrigerant circuit.
Claims7
A pressure relief arrangement in a refrigerant circuit comprising:
- a high-pressure side;
- and
- a low-pressure side, wherein the high-pressure side is fluidically connected with the low-pressure side of the refrigerant circuit via an overpressure relief device, wherein the overpressure relief device provides for pressure reduction of overpressure in case of an overpressure on the high-pressure side, and fluid flows from the high-pressure side to the low-pressure side of the refrigerant circuit, wherein the overpressure relief device is a pressure relief valve and includes a valve body, and wherein an overflow channel runs axially in the valve body.
Dependencies are inferred from the claim text.