Fast curable crash resistant adhesive composition

Abstract

The present disclosure provides a curable adhesive composition precursor, comprising a first part (A) comprising (i) at least one first epoxy curing agent selected from diamines: (ii) at least one second epoxy curing agent selected from phenalkamides and/or phenalkamines: (iii) at least one first curing aid selected from metal salt hydrates: (iv) at least one second curing aid selected from phenolic amines: a second part (B) comprising (i) at least one epoxy resin: (ii) at least one first impact modifier; (iii) at least one second impact modifier different from the at least one first impact modifier: (iv) at least one amphoteric corrosion inhibitor selected from phosphonate compounds and phosphosilicate compounds.

Dependencies are inferred from the claim text.