Two-part thermally conductive resin composition and cured product
AssigneeThreebond Co., Ltd.
InventorsHaruka HANOCHI, Takahito KOSAKA, Yosuke WATANABE
Life of this patent
Estimating the term…
Abstract
A two-part thermally conductive resin composition can be cured at normal temperature. A cured product has a sufficient resin elongation percentage. A two-part thermally conductive resin composition comprising a component (A) to a component (F): component (A): an epoxy resin (excluding epoxy resins having a (meth) acrylic-based polymer skeleton); component (B): a metal catalyst; component (C): an acrylic-based polymer and/or a polyether polyol (excluding component (D)); component (D): a crosslinkable silyl-containing organic polymer; component (E): an epoxy curing agent; and component (F): a heat dissipating filler.
Claims10
A two-part thermally conductive resin composition comprising a component (A) to a component (F) below:
- component (A):
- an epoxy resin (excluding epoxy resins having a (meth) acrylic-based polymer skeleton);
- component (B):
- a metal catalyst;
- component (C):
- an acrylic-based polymer and/or a polyether polyol (excluding component (D));
- component (D):
- a crosslinkable silyl-containing organic polymer;
- component (E):
- an epoxy curing agent;
- and
- component (F):
- a heat dissipating filler.
Dependencies are inferred from the claim text.