Bonding method and appauatus of substrates
AssigneeSky Tech Inc.
InventorsJUNG-HUA CHANG, Pei-Yun Chiang
Life of this patent
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Abstract
A bonding method of substrates for bonding a first substrate and a second substrate. The method includes: placing the first substrate on a holding surface of a holder in a confined chamber; evacuating air from the confined chamber to vacuum the confined chamber to a predetermined low pressure value; placing the second substrate on a top of the first substrate; pressing to the second substrate onto the first substrate; and allowing an outside atmosphere air to slowly enter the confined chamber by a first flow coefficient; and allowing the outside atmosphere air to rapidly enter the confined chamber with a second flow coefficient, wherein the second flow coefficient is greater than the first flow coefficient.
Claims18
A bonding method of substrates for bonding a first substrate and a second substrate, comprising:
- placing the first substrate on a holder in a confined chamber;
- evacuating air from the confined chamber to vacuum the confined chamber to a predetermined low-pressure value;
- placing the second substrate on a top of the first substrate;
- pressing to the second substrate onto the first substrate;
- allowing an outside atmosphere air to slowly enter the confined chamber by a first flow coefficient;
- and
- allowing the outside atmosphere air to rapidly enter the confined chamber with a second flow coefficient, wherein the second flow coefficient is greater than the first flow coefficient.
A bonding apparatus of substrates for bonding a first substrate and a second substrate comprising:
- a vacuum container having a confined chamber defined therein, wherein the confined chamber is configured to dispose the first substrate and the second substrate therein;
- a bonding head disposed to the vacuum container and located in the confined chamber, wherein the bonding head is configured to press the second substrate onto the first substrate;
- an air evacuating pipe configured to connect the confined chamber to a vacuum pump, to evacuate air from the confined chamber;
- an air inlet pipe connected to the confined chamber;
- and
- a two-stage valve assembly connected to the confined chamber via the air inlet pipe;
- wherein the two-stage valve assembly is configured to allow an outside atmosphere air to enter the confined chamber to raise a pressure in the confined chamber;
- wherein a flow coefficient of the two-stage valve assembly is configured to be selectively switched into a first flow coefficient and a second flow coefficient, and the second flow coefficient is greater than the first flow coefficient.
Dependencies are inferred from the claim text.