# US 2025/0098511 A1 · Display device and method of manufacturing the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2025/0098511 A1 - Document ID: US20250098511A1 - Status: Published application - Kind: A1 - Application number: 18/752,808 - Filed: 2024-06-25 - Published: 2025-03-20 - Earliest claimed: 2023-09-15 - Assignees: Samsung Display Co., Ltd. - Applicants: Samsung Display Co., Ltd. - Inventors: AHNHO JEE - Web page: https://patentgrep.com/patent/US20250098511A1 ## CPC - H10K 71/50: Forming devices by joining two substrates together, e.g. lamination techniques - H10K 59/1201: {Manufacture or treatment} - H10K 59/1275: {Electrical connections of the two substrates} - H10K 71/60: Forming conductive regions or layers, e.g. electrodes - H10K 71/621: {Providing a shape to conductive layers, e.g. patterning or selective deposition} - H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES ## Abstract Disclosed is a method of manufacturing a display device, the method including manufacturing an electronic component and attaching the electronic component to a display panel using a conductive adhesive member. The manufacturing of the electronic component includes providing a substrate and a conductive layer disposed on the substrate, a primary etching of the conductive layer to form a preliminary bump electrode, and a secondary etching of the preliminary bump electrode to form a bump electrode. ## Claims ### Claim 1 A method of manufacturing a display device, the method comprising: manufacturing an electronic component; and attaching the electronic component to a display panel using a conductive adhesive member, wherein the manufacturing of the electronic component includes: providing a substrate and a conductive layer disposed on the substrate; performing a primary etching of the conductive layer to form a preliminary bump electrode; and performing a secondary etching of the preliminary bump electrode to form a bump electrode. ### Claim 2 (depends on 1) The method of claim 1, wherein the preliminary bump electrode includes a protrusion protruding in a side direction, and the protrusion is removed in the secondarily etching of the preliminary bump electrode. ### Claim 3 (depends on 1) The method of claim 1, wherein the primary etching of the conductive layer is performed during a first etching time, the secondary etching of the preliminary bump electrode is performed during a second etching time, and the second etching time is shorter than the first etching time. ### Claim 4 (depends on 1) The method of claim 1, wherein the manufacturing of the electronic component further includes: forming a first photoresist pattern on the conductive layer using a half-tone mask after the providing of the substrate and the conductive layer and before the primary etching of the conductive layer. ### Claim 5 (depends on 4) The method of claim 4, further comprising: removing a portion of the first photoresist pattern to form a second photoresist pattern after the primary etching of the conductive layer and before the secondary etching of the preliminary bump electrode; and removing the second photoresist pattern after the secondary etching of the preliminary bump electrode. ### Claim 6 (depends on 5) The method of claim 5, wherein the first photoresist pattern includes a first pattern part and a second pattern part that is thinner than the first pattern part, and in the removing of the portion of the first photoresist pattern, the second pattern part is removed, and an upper portion of the preliminary bump electrode is exposed. ### Claim 7 (depends on 1) The method of claim 1, wherein the manufacturing of the electronic component further includes: forming a photoresist pattern using a mask in which an exposure opening is defined after the providing of the substrate and the conductive layer and before the primary etching of the conductive layer; and removing the photoresist pattern after the secondary etching of the preliminary bump electrode. ### Claim 8 (depends on 7) The method of claim 7, wherein in both the primary etching of the conductive layer and the secondary etching of the preliminary bump electrode, the photoresist pattern is used as the mask. ### Claim 9 (depends on 1) The method of claim 1, wherein the manufacturing of the electronic component further includes: forming a first photoresist pattern using a first mask in which a first exposure opening is defined after the providing of the substrate and the conductive layer and before the primary etching of the conductive layer; and forming a second photoresist pattern using a second mask in which a second exposure opening is defined after the primary etching of the conductive layer and before the secondary etching of the preliminary bump electrode, and a width of the second photoresist pattern is smaller than a width of the first photoresist pattern. ### Claim 10 (depends on 1) The method of claim 1, wherein the bump electrode does not include a portion having a width that widens in a direction from a lower surface to an upper surface thereof. ### Claim 11 (depends on 1) The method of claim 1, wherein in the attaching of the electronic component to the display panel, the conductive adhesive member is in contact with an upper surface and a side surface of the bump electrode. ### Claim 12 (depends on 1) The method of claim 1, wherein a side surface of the bump electrode includes: a first side surface portion extending from a lower surface of the bump electrode; and a second side surface portion extending from the first side surface portion to an upper surface of the bump electrode and configured to define a bend point with the first side surface portion. ### Claim 13 (depends on 1) The method of claim 1, wherein a side surface of the bump electrode has a substantially constant inclination. ### Claim 14 (depends on 1) The method of claim 1, wherein the electronic component is any one of a flexible circuit board and a driving circuit chip. ### Claim 15 A display device comprising: a display panel including a base layer and a display pad disposed on the base layer; an electronic component disposed on the display panel and including a substrate and a bump electrode disposed under the substrate; and a conductive adhesive member configured to electrically connect the display panel and the electronic component, wherein a side surface of the bump electrode includes: a first side surface portion extending from a lower surface of the bump electrode; and a second side surface portion extending from the first side surface portion to an upper surface of the bump electrode and configured to define a bend point with the first side surface portion, and the conductive adhesive member is in contact with the first side surface portion and the second side surface portion. ### Claim 16 (depends on 15) The display device of claim 15, wherein an inclination of the second side surface portion is smaller than an inclination of the first side surface portion. ### Claim 17 (depends on 15) The display device of claim 15, wherein the second side surface portion defines a recessed portion. ### Claim 18 (depends on 15) The display device of claim 15, wherein the bump electrode does not include a portion having a width that widens in a direction from the lower surface to the upper surface thereof. ### Claim 19 (depends on 15) The display device of claim 15, wherein the conductive adhesive member includes an adhesive resin and conductive balls dispersed in the adhesive resin. ### Claim 20 (depends on 15) The display device of claim 15, wherein the electronic component is any one of a flexible circuit board and a driving circuit chip.