# US 2025/0098384 A1 · Package structure > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2025/0098384 A1 - Document ID: US20250098384A1 - Status: Published application - Kind: A1 - Application number: 18/777,486 - Filed: 2024-07-18 - Published: 2025-03-20 - Earliest claimed: 2023-09-19 - Assignees: Lextar Electronics Corporation - Applicants: Lextar Electronics Corporation - Inventors: Jin-Wen LO; Yun-Jie TSAI; Pin-Feng HUNG; Kuo-Jen LAN; Cheng-Min HSIEH - Web page: https://patentgrep.com/patent/US20250098384A1 ## CPC - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10H 20/8506: {Containers} - H10H 20/8512: {Wavelength conversion materials} - H10H 20/854: characterised by their material, e.g. epoxy or silicone resins - H10H 20/8514: {characterised by their shape, e.g. plate or foil} - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS ## Abstract A package structure is provided. The package structure includes a lead frame, a first connecting piece, a light-emitting diode, an engaging protrusion, and a fluorescent encapsulant. The lead frame has an upper surface, a lower surface, and a side surface between the upper surface and the lower surface. The first connecting piece is disposed at the center of the upper surface. The light-emitting diode is disposed on the first connecting piece. The engaging protrusion is disposed on the periphery of the upper surface. The fluorescent encapsulant is disposed on the upper surface and covers the light-emitting diode and the engaging protrusion. ## Claims ### Claim 1 A package structure, comprising: a lead frame having an upper surface, a lower surface, and a side surface, wherein the side surface is between the upper surface and the lower surface; a first connecting piece disposed at a center of the upper surface; a light-emitting diode disposed on the first connecting piece; an engaging protrusion disposed on a periphery of the upper surface; and a fluorescent encapsulant disposed on the upper surface and covering the light-emitting diode and the engaging protrusion. ### Claim 2 (depends on 1) The package structure as claimed in claim 1, wherein the lead frame has a corner, and the engaging protrusion is on the corner of the lead frame and extends along two adjacent sides of the lead frame. ### Claim 3 (depends on 2) The package structure as claimed in claim 2, further comprising a step portion, wherein the step portion is between the engaging protrusion and the lead frame. ### Claim 4 (depends on 3) The package structure as claimed in claim 3, wherein in a plan view, an area of the step portion is larger than an area of the engaging protrusion. ### Claim 5 (depends on 3) The package structure as claimed in claim 3, wherein the engaging protrusion has a first through hole, and a part of the fluorescent encapsulant is in the first through hole. ### Claim 6 (depends on 3) The package structure as claimed in claim 3, wherein the step portion has a second through hole, and a part of the fluorescent encapsulant is in the second through hole. ### Claim 7 (depends on 3) The package structure as claimed in claim 3, wherein the engaging protrusion has a first through hole, the step portion has a second through hole, and a part of the fluorescent encapsulant is in the first through hole and the second through hole. ### Claim 8 (depends on 1) The package structure as claimed in claim 1, wherein the lead frame has one side, and the engaging protrusion is on the side of the lead frame and extends toward a corner of the lead frame. ### Claim 9 (depends on 1) The package structure as claimed in claim 1, wherein the engaging protrusion is disposed around the lead frame. ### Claim 10 (depends on 1) The package structure as claimed in claim 1, wherein a material of the engaging protrusion is different from a material of the lead frame. ### Claim 11 (depends on 1) The package structure as claimed in claim 1, wherein a length, a width, or a height of the engaging protrusion is greater than 0.1 mm. ### Claim 12 (depends on 1) The package structure as claimed in claim 1, wherein the light-emitting diode is a blue LED, and the fluorescent encapsulant comprises yellow light conversion materials. ### Claim 13 (depends on 1) The package structure as claimed in claim 1, further comprising a white encapsulant disposed on the fluorescent encapsulant. ### Claim 14 (depends on 13) The package structure as claimed in claim 13, wherein the lead frame has a width, the fluorescent encapsulant has a first thickness, the white encapsulant has a second thickness, and the sum of the first thickness and the second thickness is less than or equal to the width. ### Claim 15 (depends on 13) The package structure as claimed in claim 13, wherein the fluorescent encapsulant has a first thickness, the white encapsulant has a second thickness, and a ratio of the first thickness to the second thickness is between 3 and 18. ### Claim 16 (depends on 1) The package structure as claimed in claim 1, further comprising a second connecting piece disposed on the upper surface, and the second connecting piece is between the engaging protrusion and the first connecting piece. ### Claim 17 (depends on 1) The package structure as claimed in claim 1, further comprising a supporting piece disposed in the lead frame, wherein a mechanical strength of the supporting piece is higher than a mechanical strength of the lead frame. ### Claim 18 (depends on 17) The package structure as claimed in claim 17, wherein at least a part of the supporting piece is on a side of the lead frame adjacent to the upper surface. ### Claim 19 (depends on 18) The package structure as claimed in claim 18, wherein the entire supporting piece is on the side of the lead frame adjacent to the upper surface. ### Claim 20 (depends on 1) The package structure as claimed in claim 1, wherein the engaging protrusion is wavy or stepped in a side view.