# US 2025/0098119 A1 · Conductor cooling structure

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- Number: US 2025/0098119 A1
- Document ID: US20250098119A1
- Status: Published application
- Kind: A1
- Application number: 18/805,903
- Filed: 2024-08-15
- Published: 2025-03-20
- Earliest claimed: 2023-09-20
- Assignees: Yazaki Corporation
- Applicants: Yazaki Corporation
- Inventors: Kazuki SHIROSAKA; Junya Higashi; Hiroyuki Tanaka
- Web page: https://patentgrep.com/patent/US20250098119A1

## CPC

- H05K 7/20454: {with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste}
- H10W 40/611: {Bolts or screws}
- H01H 9/52: Cooling of switch parts (cooling of contacts H01H1/62)
- H05K 7/2049: {Pressing means used to urge contact, e.g. springs}
- H10W 40/10: Arrangements for heating
- H10W 40/255: {having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates}
- H10W 72/00: Interconnections or connectors in packages
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H01H: ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES (contact cables H01B7/10; electrolytic self-interrupters H01G9/18; emergency protective circuit arrangements H02H; switching by electronic means without contact-making H03K17/00)

## Abstract

A conductor cooling structure includes a cooling plate formed into a band plate shape made of a conductive metal and being a flat plate like member configured to cool a conductor member with a predetermined electric/electronic component being fixed to a front surface of the cooling plate in such a state that the conductor member is placed on the front surface of the cooling plate, the conductor member configured to be energized with one end side of the conductor member being connected to a component terminal of the electric/electronic component, and the other end side of the conductor member being connected to an electrical connection target of the electric/electronic component, a conductor groove being formed on the front surface of the cooling plate, the conductor groove extending along a shape of a longitudinal direction of the conductor member and formed to have a sufficient depth to accommodate at least a portion of the conductor member in a thickness direction thereof, and a heat transfer member covering an area larger than at least the conductor groove on the front surface of the cooling plate so as to be sandwiched between a groove inner surface of the conductor groove and the conductor member, the heat transfer member being made of an insulating material that transfers heat of the conductor member to the cooling plate.

## Claims

### Claim 1

A conductor cooling structure comprising:
a cooling plate formed into a band plate shape made of a conductive metal and being a flat plate-shaped member configured to cool a conductor member with a predetermined electric/electronic component being fixed to a front surface of the cooling plate in such a state that the conductor member is placed on the front surface of the cooling plate, the conductor member configured to be energized with one end side of the conductor member being connected to a component terminal of the electric/electronic component, and the other end side of the conductor member being connected to an electrical connection target of the electric/electronic component, a conductor groove being formed on the front surface of the cooling plate, the conductor groove extending along a shape of a longitudinal direction of the conductor member and formed to have a sufficient depth to accommodate at least a portion of the conductor member in a thickness direction thereof; and
a heat transfer member covering an area larger than at least the conductor groove on the front surface of the cooling plate so as to be sandwiched between a groove inner surface of the conductor groove and the conductor member, the heat transfer member being made of an insulating material that transfers heat of the conductor member to the cooling plate.

### Claim 2 (depends on 1)

The conductor cooling structure according to claim 1, wherein the conductor groove is a groove that is wider than the conductor member by an amount of a thickness of the heat transfer member.

### Claim 3 (depends on 1)

The conductor cooling structure according to claim 1, wherein the heat transfer member is arranged to cover an entire surface of the front surface of the cooling plate.

### Claim 4 (depends on 3)

The conductor cooling structure according to claim 3, wherein a component fixing stud is provided vertically on the front surface of the cooling plate, the electric/electronic component having the component terminal connected to the conductor member is fixed to the component fixing stud so as to press the conductor member against the conductor groove with the heat transfer member being sandwiched between the groove inner surface and the conductor member, and
the heat transfer member is provided with a stud through hole through which the component fixing stud penetrates.

### Claim 5 (depends on 1)

The conductor cooling structure according to claim 1, wherein the heat transfer member is a flexible sheet material that, when the conductor member is pressed against the conductor groove, is crushed in a member thickness direction of the heat transfer member and comes into close contact with both a groove bottom surface of the groove inner surface and a groove opposing surface, facing the groove bottom surface, of front and back surfaces of the conductor member, and also with both groove side surfaces of the groove inner surface and side edge surfaces, extending in the thickness direction, of the conductor member.