# US 2025/0098071 A1 · Printed circuit board > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2025/0098071 A1 - Document ID: US20250098071A1 - Status: Published application - Kind: A1 - Application number: 18/968,315 - Filed: 2024-12-04 - Published: 2025-03-20 - Earliest claimed: 2020-11-19 - Assignees: Samsung Electro-Mechanics Co., Ltd. - Applicants: Samsung Electro-Mechanics Co., Ltd. - Inventors: Jung Hyun CHO; Jin Won LEE; Byung Kuk KANG; Chang Soo WOO - Web page: https://patentgrep.com/patent/US20250098071A1 ## CPC - H05K 1/165: {incorporating printed inductors} - H01F 17/0013: {with stacked layers} - H01F 17/04: with magnetic core - H01F 27/24: Magnetic cores - H01F 27/2804: {Printed windings} - H01F 27/306: {Fastening or mounting coils or windings on core, casing or other support} - H05K 1/0298: {Multilayer circuits} - H05K 1/115: {Via connections; Lands around holes or via connections (H05K1/112 takes precedence)} - H05K 3/4602: {characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated} - H01F 2017/002: {Details of via holes for interconnecting the layers} - H05K 2201/086: for inductive purposes, e.g. printed inductor with ferrite core - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES ## Abstract A printed circuit board includes: a core substrate including a plurality of core layers; a plurality of magnetic members embedded in each of the plurality of core layers; a first coil pattern disposed on the core substrate; and a second coil pattern disposed below the core substrate. ## Claims ### Claim 1 A printed circuit board comprising: a core substrate including a plurality of core layers; a plurality of magnetic members embedded in each of the plurality of core layers; a first coil pattern disposed on the core substrate; and a second coil pattern disposed below the core substrate, wherein the first and second coil patterns include a plurality of first and second connection parts spaced apart from each other, respectively, and a plurality of connection vias connecting the plurality of first and second connection parts to each other; and the plurality of connection vias are disposed to surround the plurality of magnetic members on at least one side thereof. ### Claim 2 (depends on 1) The printed circuit board of claim 1, further comprising: a cavity disposed in each of the plurality of core layers; and build-up layers disposed on one surface and the other surface of the core substrate, respectively. ### Claim 3 (depends on 2) The printed circuit board of claim 2, wherein the plurality of magnetic members are disposed in the cavity. ### Claim 4 (depends on 3) The printed circuit board of claim 3, wherein a plurality of cavities are disposed in each of the plurality of core layers, the plurality of magnetic members include at least one of first and second magnetic members, the first magnetic member includes a magnetic element; and the second magnetic member includes a base layer and a magnetic layer disposed on the base layer. ### Claim 5 (depends on 4) The printed circuit board of claim 4, further comprising a through via penetrating through the core substrate, wherein the build-up layers include a plurality of insulating layers and a plurality of wiring layers disposed on the plurality of insulating layers. ### Claim 6 (depends on 5) The printed circuit board of claim 5, wherein the core substrate further includes a first core insulating layer disposed between the plurality of core layers, and at least some of the plurality of magnetic members are disposed on one surface and the other surface of the first core insulating layer. ### Claim 7 (depends on 5) The printed circuit board of claim 5, wherein the core substrate further includes a second core insulating layer disposed between the first coil pattern and the plurality of core layers and a third core insulating layer disposed between the second coil pattern and the plurality of core layers, and at least some of the plurality of magnetic members are in contact with the second core insulating layer and the third core insulating layer. ### Claim 8 (depends on 5) The printed circuit board of claim 5, wherein the first and second coil patterns include first and second connection pads, respectively, each of the first and second connection pads being disposed at one or both ends of the respective coil patterns. ### Claim 9 (depends on 5) The printed circuit board of claim 5, further comprising a connection via connecting respective innermost ends of the first and second coil patterns to each other. ### Claim 10 (depends on 9) The printed circuit board of claim 9, wherein the connection via penetrates through the magnetic members. ### Claim 11 (depends on 5) The printed circuit board of claim 5, wherein each of the first and second coil patterns has a plurality of layers stacked in a thickness direction. ### Claim 12 (depends on 5) The printed circuit board of claim 5, further comprising an electronic component disposed on one of the build-up layers disposed on the one surface and the other surface of the core substrate, wherein the magnetic layer is disposed on one of one surface and the other surface of the base layer that is closer to the electronic component. ### Claim 13 (depends on 4) The printed circuit board of claim 4, wherein the base layer includes a wafer containing silicon (Si), and the magnetic layer contains a cobalt-tantalum-zirconium alloy. ### Claim 14 (depends on 1) The printed circuit board of claim 1, further comprising: a first connection pad connected to an end of each of at least some of the plurality of first connection parts; a second connection pad disposed adjacent to a side surface of each of at least one of the plurality of second connection parts; and a pad connection via penetrating through the core substrate to connect the first and second connection pads to each other.