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US 2025/0096907 A1Published application
Led chip-to-chip vertically launched optical communications with optical fiber
AssigneeAvicenaTech, Corp.
InventorsBardia Pezeshki, Robert Kalman, Alexander Tselikov, Cameron Danesh
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Abstract
Multi-chip modules in different semiconductor packages may be optically data coupled by way of LEDs and photodetectors linked by a multicore fiber. The multicore fiber may pass through apertures in the semiconductor packages, with an array of LEDs and photodetectors in the semiconductor package providing and receiving, respectively, optical signals comprised of data passed between the multi-chip modules.
Claims12
An optically interconnected system, comprising:
- a multicore fiber;
- a first semiconductor package with a first aperture to receive a first end of the multicore fiber;
- first semiconductor logic circuitry mounted on a first substrate in the first semiconductor package, the first substrate having a first substrate aperture aligned with the first aperture of the first semiconductor package so as to form an aperture through the first substrate and the first semiconductor package;
- first transceiver circuitry, in the first semiconductor package, electrically coupled to the first semiconductor logic circuitry;
- a plurality of first microLEDs, in the first semiconductor package, electrically coupled to be driven by the first transceiver circuitry, the plurality of first microLEDs positioned to emit light into the first end of a multicore fiber;
- and
- a plurality of first photodetectors, in the first semiconductor package, electrically coupled to provide signals to the first transceiver circuitry, the plurality of first photodetectors positioned to receive light from the first end of the multicore fiber.
4 more elements
-11. (canceled)
-15. (canceled)
Dependencies are inferred from the claim text.