Electronic package structure
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsChi Sheng TSENG, Lu-Ming LAI, Ching-Han HUANG, Kuo-Hua LAI, Hui-Chung LIU
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Abstract
The present disclosure provides a semiconductor package structure. The semiconductor package structure includes a substrate, a first electronic component and a support component. The first electronic component is disposed on the substrate. The first electronic component has a backside surface facing a first surface of the substrate. The support component is disposed between the backside surface of the first electronic component and the first surface of the substrate. The backside surface of the first electronic component has a first portion connected to the support component and a second portion exposed from the support component.
Claims20
An electronic package structure, comprising:
- a carrier;
- a first electronic component disposed adjacent to the carrier, wherein the first electronic component comprises a heat source region;
- a second electronic component is thermally connected to the heat source region by a connecting layer;
- and
- a wire electrically connecting the first electronic component and the carrier, wherein the wire has a first end and a second end opposite to the first end, wherein the second end of the wire is on the carrier and below a top surface of the carrier.
An electronic package structure, comprising:
- a carrier;
- a first electronic component disposed adjacent to the carrier, wherein the first electronic component comprises a heat source region configured to thermally connected to a second electronic component;
- and
- a support component disposed between the first electronic component and the carrier, wherein a projection of the support component on the carrier and a projection of the heat source region on the carrier overlap in a vertical direction.
An electronic package structure, comprising:
- a ceramic substrate;
- a first electronic component disposed on the ceramic substrate, the first electronic component having a first surface and a second surface opposite to the first surface, wherein the first electronic component is configured to provide a heat source;
- and
- a support structure and an insulator disposed between the first surface of the first electronic component and the ceramic substrate, wherein an equivalent thermal resistance of the support structure and the insulator is greater than a thermal resistance of the ceramic substrate.
Dependencies are inferred from the claim text.