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US 2025/0096768 A1Published application
Metal ribs in electromechanical devices
OwnerAnindya PODDAR, Hau NGUYEN +1inventors
InventorsAnindya PODDAR, Hau NGUYEN, Masamitsu MATSUURA
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Abstract
In examples, a device comprises a semiconductor die, a thin-film layer, and an air cavity positioned between the semiconductor die and the thin-film layer. The air cavity comprises a resonator positioned on the semiconductor die. A rib couples to a surface of the thin-film layer opposite the air cavity.
Claims20
A device, comprising:
- a semiconductor die;
- a first film on the semiconductor die;
- an air cavity between the semiconductor die and the first film;
- and
- a second film on a surface of the first film opposite the air cavity.
2 more elements
A device, comprising:
- a semiconductor die including a trench around a platform of the semiconductor die;
- a first film on the semiconductor die;
- and
- a second film on the first film.
1 more element
Dependencies are inferred from the claim text.