# US 2025/0096480 A1 · Electromagnetic wave reflecting device, electromagnetic wave reflecting fence, and reflection panel

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- Number: US 2025/0096480 A1
- Document ID: US20250096480A1
- Status: Published application
- Kind: A1
- Application number: 18/963,018
- Filed: 2024-11-27
- Published: 2025-03-20
- Earliest claimed: 2022-06-01
- Assignees: AGC Inc.
- Applicants: AGC Inc.
- Inventors: Kumiko Kambara; Shinji Ueki
- Web page: https://patentgrep.com/patent/US20250096480A1

## CPC

- H01Q 15/0086: {said selective devices having materials with a synthesized negative refractive index, e.g. metamaterials or left-handed materials}
- H01Q 15/14: Reflecting surfaces; Equivalent structures {(electromagnetic shields H01Q1/526)}
- H01Q 15/0026: {said selective devices having a stacked geometry or having multiple layers}
- H01Q 15/141: {Apparatus or processes specially adapted for manufacturing reflecting surfaces}
- H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72)

## Abstract

An electromagnetic wave reflecting device includes: a reflection panel configured to reflect radio waves of a desired band selected from a frequency band between 1 GHz and 170 GHz; and a frame configured to hold the reflection panel. The reflection panel includes: a dielectric layer; a conductive pattern periodically provided on one surface of the dielectric layer; a ground layer provided on the other surface of the dielectric layer; and an adhesive layer configured to bond the conductive pattern to the one surface of the dielectric layer, and a gap is provided in the adhesive layer.

## Claims

### Claim 1

An electromagnetic wave reflecting device, comprising:
a reflection panel configured to reflect radio waves of a desired band selected from a frequency band between 1 GHZ and 170 GHz; and
a frame configured to hold the reflection panel, wherein
the reflection panel includes
a dielectric layer,
a conductive pattern periodically provided on one surface of the dielectric layer,
a ground layer provided on the other surface of the dielectric layer, and
an adhesive layer configured to bond the conductive pattern to the one surface of the dielectric layer, and
a gap is provided in the adhesive layer.

### Claim 2 (depends on 1)

The electromagnetic wave reflecting device according to claim 1, wherein
a thickness of the adhesive layer is 0.002 mm or more and 0.05 mm or less, and an occupancy of the adhesive layer with respect to the dielectric layer is 9.0% or more and 50.0% or less.

### Claim 3 (depends on 2)

The electromagnetic wave reflecting device according to claim 2, wherein
a thickness of the conductive pattern is 0.01 mm or more and 0.05 mm or less, and an occupancy of the conductive pattern with respect to the dielectric layer is 10.0% or more and 45.0% or less.

### Claim 4 (depends on 3)

The electromagnetic wave reflecting device according to claim 3, wherein
the adhesive layer and the conductive pattern are adhered to each other, and a difference in the occupancy is 0.0% or more and 40.0% or less.

### Claim 5 (depends on 1)

The electromagnetic wave reflecting device according to claim 1, further comprising:
an intermediate layer covering the adhesive layer and the conductive pattern, wherein
the intermediate layer fills at least a part of the gap of the adhesive layer.

### Claim 6 (depends on 5)

The electromagnetic wave reflecting device according to claim 5, further comprising:
a dielectric substrate bonded on a conductive pattern side by the intermediate layer.

### Claim 7 (depends on 1)

An electromagnetic wave reflecting fence, wherein
a plurality of the electromagnetic wave reflecting devices each being the electromagnetic wave reflecting device of claim 1 are joined by the frame.

### Claim 8 (depends on 7)

The electromagnetic wave reflecting fence according to claim 7, wherein
at least a part of the reflection panel is a metasurface at which an angle of incidence differs from an angle of reflection.

### Claim 9

A reflection panel, comprising:
a dielectric layer;
a conductive pattern periodically provided on one surface of the dielectric layer;
a ground layer provided on another surface of the dielectric layer; and
an adhesive layer configured to bond the conductive pattern to the one surface of the dielectric layer, wherein
a gap is provided in the adhesive layer.
