# US 2025/0096210 A1 · Power module with stacked structure > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2025/0096210 A1 - Document ID: US20250096210A1 - Status: Published application - Kind: A1 - Application number: 18/661,267 - Filed: 2024-05-10 - Published: 2025-03-20 - Earliest claimed: 2023-09-19 - Assignees: Monolithic Power Systems, Inc. - Applicants: Monolithic Power Systems, Inc. - Inventors: Ting Ge; Daocheng Huang - Web page: https://patentgrep.com/patent/US20250096210A1 ## CPC - H10W 90/00: Package configurations - H01F 27/08: Cooling (heat-transfer elements F28F); Ventilating (structural details of casings H01F27/02) - H01F 37/00: Fixed inductances not covered by group H01F17/00 - H02M 1/327: {against abnormal temperatures} - H02M 3/003: {Constructional details, e.g. physical layout, assembly, wiring or busbar connections} - H02M 3/1584: {with a plurality of power processing stages connected in parallel} - H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections - H10W 70/65: Shapes or dispositions of interconnections - H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts} - H01F 27/266: {Fastening or mounting the core on casing or support (on coil H01F27/30)} - H02M 3/1586: {switched with a phase shift, i.e. interleaved} - H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES - H02M: APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF (transformers H01F; dynamo-electric converters H02K47/00; controlling transformers, reactors or choke coils, control or regulation of electric motors, generators or dynamo-electric converters H02P) ## Abstract A power module has an inductor assembly and a device substrate. The inductor assembly comprises a magnetic core, a first winding and a second winding. Each of the first winding and the second winding has a first end and a second end exposed at the second surface of the inductor assembly. The device substrate has a first power device chip and a second power device chip at least partially embedded within the device substrate. The device substrate further has a first top heat layer at least partially covering the first power device chip and a second top heat layer at least partially covering the second power device chip. The first end of the first winding is electrically connected to the first top heat layer, and the first end of the second winding is electrically connected to the second top heat layer. ## Claims ### Claim 1 A power module, comprising: a device substrate having a first surface and a second surface opposite to the first surface of the device substrate, wherein the device substrate comprises a first power device chip, a second power device chip, a first top heat layer at least partially covering the first power device chip, and a second top heat layer at least partially covering the second power device chip, wherein each of the first top heat layer and the second top heat layer has a surface exposed at the first surface of the device substrate; and an inductor assembly having a first surface and a second surface opposite to the first surface of the inductor assembly, the inductor assembly comprising: a magnetic core; a first winding and a second winding at least partially embedded within the magnetic core, wherein each of the first winding and the second winding has a first end and a second end exposed at the second surface of the inductor assembly; and a first heat sink layer and a second heat sink layer wrapping at least partial of the inductor assembly; wherein the first heat sink layer and the first end of the first winding are electrically connected to the first top heat layer, and the second heat sink layer and the first end of the second winding are electrically connected to the second top heat layer. ### Claim 2 (depends on 1) The power module of claim 1, further comprising: a bottom substrate having a first surface and a second surface opposite to the first surface of the bottom substrate, the second surface of the bottom substrate comprising: a first output voltage pad area having at least one pad; a second output voltage pad area having at least one pad; an input pad area having at least one pad; a ground pad area having at least one pad; and a signal pad area having at least two pads; wherein the device substrate is arranged on the bottom substrate with the second surface of the device substrate facing the first surface of the bottom substrate, and the inductor assembly is arranged on the device substrate with the second surface of the inductor assembly facing the first surface of the device substrate; and wherein the second end of the first winding is electrically connected to the at least one pad of the first output voltage pad area via the device substrate, and the second end of the second winding is electrically connected to the at least one pad of the second output voltage pad area via the device substrate. ### Claim 3 (depends on 2) The power module of claim 2, wherein each one of the first power device chip and the second power device chip comprises: a driver; a first switch, a second switch, and a switching pin electrically connected to a common node of the first switch and the second switch; an input pin electrically connected to the at least one pad of the input pad area; a ground pin electrically connected to the at least one pad of the ground pad area; and a driving pin electrically connected to one pad of the at least two pads of the signal pad area; wherein the first switch has a first terminal coupled to the input pin, a second terminal coupled to the switching pin, and a control terminal configured to receive a first driving signal, and the second switch has a first terminal coupled to the switching pin, a second terminal coupled to the ground pin, and a control terminal configured to receive a second driving signal; and wherein the driver is coupled to the driving pin to receive a phase control signal, and to provide the first driving signal and the second driving signal based on the phase control signal. ### Claim 4 (depends on 1) The power module of claim 1, wherein: each of the first power device chip and the second power device chip comprises a first switch, a second switch, and a switching pin electrically connected to a common node of the first switch and the second switch; and wherein the device substrate further comprises a first connecting pillar and a second connecting pillar, wherein the first connecting pillar is electrically connected to the switching pin of the first power device chip, the second connecting pillar is electrically connected to the switching pin of the second power device chip. ### Claim 5 (depends on 4) The power module of claim 4, wherein: the device substrate further comprises a third connecting pillar and a fourth connecting pillar, wherein the second end of the first winding is electrically connected to the third connecting pillar, and the second end of the second winding is electrically connected to the fourth connecting pillar. ### Claim 6 (depends on 4) The power module of claim 4, wherein: the first power device chip has a top surface partially covered by the first top heat layer, and the second power device chip has a top surface partially covered by the second top heat layer, wherein each of the top surfaces of the first power device chip and the second power device chip has a short edge and a long edge, the first connecting pillar is placed next to the long edge of the top surface of the first power device chip, and the second connecting pillar is placed next to the long edge of the top surface of the second power device chip; and wherein the first heat sink layer is electrically connected to the first connecting pillar, and the second heat sink layer is electrically connected to the second connecting pillar. ### Claim 7 (depends on 6) The power module of claim 6, wherein the first heat sink layer is physically attached to an end of the first connecting pillar by soldering or via a conductive adhesive, and wherein the second heat sink layer is physically attached to an end of the second connecting pillar by soldering or via a conductive adhesive. ### Claim 8 (depends on 1) The power module of claim 1, wherein: each of the first power device chip and the second power device chip comprises a first switch, a second switch, and a switching pin electrically connected to a common node of the first switch and the second switch; and wherein the switching pin of the first power device chip is electrically connected to the first top heat layer, the first heat sink layer and the first end of the first winding; the switching pin of the second power device chip is electrically connected to the second top heat layer, the second heat sink layer and the first end of the second winding. ### Claim 9 (depends on 1) The power module of claim 1, wherein: the first heat sink layer has a first portion covering at least partial of the second surface of the inductor assembly and a second portion covering at least partial of a third surface of the inductor assembly, wherein the third surface of the inductor assembly is vertical to the first surface and the second surface of the inductor assembly; and wherein the second heat sink layer has a first portion covering at least partial of the second surface of the inductor assembly and a second portion covering at least partial of a fourth surface of the inductor assembly, wherein the fourth surface of the inductor assembly is vertical to the first surface and the second surface of the inductor assembly and opposite to the third surface of the inductor assembly. ### Claim 10 (depends on 9) The power module of claim 9, wherein the first portion of the first heat sink layer and the first end of the first winding are physically attached to the surface of the first top heat layer by soldering or via a conductive adhesive, and wherein the first portion of the second heat sink layer and the first end of the second winding are physically attached to the surface of the second top heat layer by soldering or via a conductive adhesive. ### Claim 11 A power module, comprising: an inductor assembly having a first surface and a second surface opposite to the first surface of the inductor assembly, wherein the inductor assembly comprises a magnetic core, a first winding and a second winding at least partially embedded within the magnetic core, and wherein each of the first winding and the second winding has a first end and a second end exposed at the second surface of the inductor assembly; and a device substrate having a first surface and a second surface opposite to the first surface of the device substrate, the device substrate comprising: a first power device chip and a second power device chip at least partially embedded within the device substrate, wherein each of the first power device chip and the second power device chip has a first switch, a second switch and a switching pin electrically connected to a common node of the first switch and the second switch; a first top heat layer at least partially covering the first power device chip; a second top heat layer at least partially covering the second power device chip; a first connecting pillar electrically connected to the switching pin of the first power device chip; and a second connecting pillar electrically connected to the switching pin of the second power device chip; wherein the first end of the first winding is electrically connected to the first top heat layer and the first connecting pillar, and the first end of the second winding is electrically connected to the second top heat layer and the second connecting pillar. ### Claim 12 (depends on 11) The power module of claim 11, further comprising: a bottom substrate having a first surface and a second surface opposite to the first surface of the bottom substrate, wherein the second surface of the bottom substrate comprises a first output voltage pad area and a second output voltage pad area, each of the first output voltage pad area and the second output voltage pad area having at least one pad; wherein the device substrate is arranged on the bottom substrate with the second surface of the device substrate facing the first surface of the bottom substrate, and the inductor assembly is arranged on the device substrate with the second surface of the inductor assembly facing the first surface of the device substrate. ### Claim 13 (depends on 12) The power module of claim 12, wherein the second surface of the bottom substrate further comprises an input pad area having at least one pad, a ground pad area having at least one pad, and a signal pad area having at least two pads, and wherein each of the first power device chip and the second power device chip further comprises: a driver; an input pin electrically connected to the at least one pad of the input pad area; a ground pin electrically connected to the at least one pad of the ground pad area; and a driving pin electrically connected to one pad of the at least two pads of the signal pad area; wherein the first switch has a first terminal coupled to the input pin, a second terminal coupled to the switching pin, and a control terminal configured to receive a first driving signal, and the second switch has a first terminal coupled to the switching pin, a second terminal coupled to the ground pin, and a control terminal configured to receive a second driving signal; and wherein the driver is coupled to the driving pin to receive a phase control signal, and to provide the first driving signal and the second driving signal based on the phase control signal. ### Claim 14 (depends on 12) The power module of claim 12, wherein: the device substrate further comprises a third connecting pillar and a fourth connecting pillar; and wherein the second end of the first winding is electrically connected to the at least one pad of the first output voltage pad area via the third connecting pillar, and the second end of the second winding is electrically connected to the at least one pad of the second output voltage pad area via the fourth connecting pillar. ### Claim 15 (depends on 11) The power module of claim 11, wherein each of the first winding and the second winding comprises: a first portion providing the first end of the corresponding winding; a second portion providing the second end of the corresponding winding; and a third portion having a top surface exposed at the first surface of the inductor assembly. ### Claim 16 (depends on 15) The power module of claim 15, wherein in a vertical view of the inductor assembly, the first portion and the third portion of the first winding are at least partially overlapped, and the first portion and the third portion of the second winding are at least partially overlapped. ### Claim 17 (depends on 16) The power module of claim 16, wherein: the first power device chip has a top surface partially covered by the first top heat layer, and the second power device chip has a top surface partially covered by the second top heat layer; and wherein each of the top surfaces of the first power device chip and the second power device chip has a short edge and a long edge, the first connecting pillar is placed next to the long edge of the top surface of the first power device chip, and the second connecting pillar is placed next to the long edge of the top surface of the second power device chip. ### Claim 18 (depends on 11) The power module of claim 11, wherein: each of the first top heat layer and the second top heat layer has a surface exposed at the first surface of the device substrate, and each of the first connecting pillar and the second connecting pillar has an end exposed at the first surface of the device substrate; and wherein the first end of the first winding is physically attached to the surface of the first top heat layer and the end of the first connecting pillar by soldering or via a conductive adhesive, and the first end of the second winding is physically attached to the surface of the second top heat layer and the end of the second connecting pillar by soldering or via a conductive adhesive. ### Claim 19 A power module, comprising: an inductor assembly having a first surface and a second surface opposite to the first surface of the inductor assembly, wherein the inductor assembly comprises a magnetic core, a first winding and a second winding at least partially embedded within the magnetic core, each of the first winding and the second winding having a first end and a second end exposed at the second surface of the inductor assembly; and a device substrate having a first surface and a second surface opposite to the first surface of the device substrate, the device substrate comprising: a first power device chip and a second power device chip at least partially embedded within the device substrate; a first top heat layer at least partially covering the first power device chip; and a second top heat layer at least partially covering the second power device chip; wherein the first end of the first winding is electrically connected to the first top heat layer, and the first end of the second winding is electrically connected to the second top heat layer. ### Claim 20 (depends on 19) The power module of claim 19, further comprising: a bottom substrate having a first surface and a second surface opposite to the first surface of the bottom substrate, wherein the second surface of the bottom substrate comprises a first output voltage pad area and a second output voltage pad area; wherein the first output voltage pad area has at least one pad electrically connected to the second end of the first winding, and the second output voltage pad area has at least one pad electrically connected to the second end of the second winding; and wherein the device substrate is arranged on the bottom substrate with the second surface of the device substrate facing the first surface of the bottom substrate, and the inductor assembly is arranged on the device substrate with the second surface of the inductor assembly facing the first surface of the device substrate. ### Claim 21 (depends on 19) The power module of claim 19, wherein the inductor assembly further comprising: a first heat sink layer and a second heat sink layer wrapping at least partial of the inductor assembly; wherein the first heat sink layer is electrically connected to the first top heat layer, and the second heat sink layer is electrically connected to the second top heat layer. ### Claim 22 (depends on 21) The power module of claim 21, wherein the first heat sink layer has a portion physically attached to the surface of the first top heat layer by soldering or via a conductive adhesive, and the second heat sink layer has a portion physically attached to the surface of the second top heat layer by soldering or via a conductive adhesive. ### Claim 23 (depends on 21) The power module of claim 21, wherein: the first heat sink layer has a first portion covering at least partial of the second surface of the inductor assembly and a second portion covering at least partial of a third surface of the inductor assembly, wherein the third surface of the inductor assembly is vertical to the first surface and the second surface of the inductor assembly; and wherein the second heat sink layer has a first portion covering at least partial of the second surface of the inductor assembly and a second portion covering at least partial of a fourth surface of the inductor assembly, wherein the fourth surface of the inductor assembly is vertical to the first surface and the second surface of the inductor assembly and opposite to the third surface of the inductor assembly. ### Claim 24 (depends on 19) The power module of claim 19, wherein: each of the first power device chip and the second power device chip has a first switch, a second switch and a switching pin electrically connected to a common node of the first switch and the second switch; and wherein the first top heat layer is electrically coupled to the switching pin of the first power device chip, and the second top heat layer is electrically coupled to the switching pin of the second power device chip. ### Claim 25 (depends on 24) The power module of claim 24, wherein: the device substrate further comprises a first connecting pillar and a second connecting pillar, wherein the first connecting pillar is electrically connected to the switching pin of the first power device chip, and the second connecting pillar is electrically connected to the switching pin of the second power device chip; and wherein the first heat sink layer is electrically connected to the first connecting pillar, and the second heat sink layer is electrically connected to the second connecting pillar. ### Claim 26 (depends on 24) The power module of claim 24, wherein: the device substrate further comprises a first connecting pillar and a second connecting pillar, wherein the first connecting pillar is electrically connected to the switching pin of the first power device chip and the first end of the first winding, and the second connecting pillar is electrically connected to the switching pin of the second power device chip and the first end of the second winding; and wherein the first end of the first winding is electrically connected to the first connecting pillar, and the first end of the second winding is electrically connected to the second connecting pillar. ### Claim 27 (depends on 26) The power module of claim 26, wherein each of the first and second windings has a portion having a top surface exposed at the first surface of the inductor assembly. ### Claim 28 (depends on 24) The power module of claim 24, wherein each of the first power device chip and the second power device chip further comprises: a driver; an input pin; a ground pin; and a driving pin; wherein the first switch has a first terminal coupled to the input pin, a second terminal coupled to the switching pin, and a control terminal configured to receive a first driving signal, and the second switch has a first terminal coupled to the switching pin, a second terminal coupled to the ground pin, and a control terminal configured to receive a second driving signal; and wherein the driver is coupled to the driving pin to receive a phase control signal, and to provide the first driving signal and the second driving signal based on the phase control signal.