# US 2025/0096192 A1 · Package structure and fabricating method thereof

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- Number: US 2025/0096192 A1
- Document ID: US20250096192A1
- Status: Published application
- Kind: A1
- Application number: 18/741,020
- Filed: 2024-06-12
- Published: 2025-03-20
- Earliest claimed: 2023-09-14
- Assignees: Kore Semiconductor Co., Ltd.
- Applicants: Kore Semiconductor Co., Ltd.
- Inventors: Ghang-Chun LAI; Meng-Huang SIE; Cheng-Hao HEH; Ming-Chin HSU
- Web page: https://patentgrep.com/patent/US20250096192A1

## CPC

- H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W 90/00: Package configurations
- H10W 72/90: Bond pads, in general
- H10W 46/00: Marks applied to devices, e.g. for alignment or identification
- H10W 72/01208: {using permanent auxiliary members, e.g. using solder flow barriers, spacers or alignment marks}
- H10W 72/01257: {by reflowing}
- H10W 72/072: {of bump connectors}
- H10W 72/07227: {involving guiding structures, e.g. spacers or supporting members}
- H10W 72/221: {Structures or relative sizes}
- H10W 90/722: {between stacked chips}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A package structure is provided, in which a second electronic element having a plurality of conductive bumps is stacked on a first electronic element arranged with a positioning layer. The plurality of conductive bumps are inserted into a plurality of positioning holes of the positioning layer, and the second electronic element is bonded onto the positioning layer and electrically connected to the first electronic element via the plurality of conductive bumps, such that the hybrid bonding technology is replaced via the arrangement of the positioning holes and the conductive bumps, thereby reducing packaging costs.

## Claims

### Claim 1

A package structure, comprising:
a first electronic element having a plurality of first electrode pads;
a positioning layer formed on the first electronic element and having a plurality of positioning holes exposing the plurality of first electrode pads; and
a second electronic element disposed on the positioning layer and having a plurality of second electrode pads, wherein the plurality of second electrode pads are provided with a plurality of conductive bumps accommodated in the plurality of positioning holes, so that each of the plurality of conductive bumps is in contact with each of the plurality of first electrode pads, such that the second electronic element is electrically connected to the first electronic element via the plurality of conductive bumps.

### Claim 2 (depends on 1)

The package structure of claim 1, wherein there is a gap between each of the plurality of conductive bumps and a wall surface of each of the plurality of positioning holes.

### Claim 3 (depends on 1)

The package structure of claim 1, wherein each of the plurality of conductive bumps includes a conductive pillar used to bond to each of the plurality of second electrode pads and a conductive bonding material formed on the conductive pillar.

### Claim 4 (depends on 3)

The package structure of claim 3, wherein the conductive bonding material is a solder material.

### Claim 5 (depends on 1)

The package structure of claim 1, wherein a material for forming the positioning layer is an organic insulating material.

### Claim 6

A method of fabricating a package structure, comprising:
providing a first electronic element having a plurality of first electrode pads and a second electronic element having a plurality of second electrode pads;
forming a positioning layer on the first electronic element, and forming a plurality of conductive bumps on the plurality of second electrode pads of the second electronic element, wherein the positioning layer has a plurality of positioning holes exposing the plurality of first electrode pads;
inserting the plurality of conductive bumps into the plurality of positioning holes, so that the second electronic element is bonded onto the positioning layer, wherein the plurality of conductive bumps are free from being in contact with the plurality of first electrode pads in the plurality of positioning holes; and
heating the plurality of conductive bumps, so that each of the plurality of conductive bumps is in contact with each of the plurality of first electrode pads, wherein the second electronic element is electrically connected to the first electronic element via the plurality of conductive bumps.

### Claim 7 (depends on 6)

The method of claim 6, wherein there is a gap between each of the plurality of conductive bumps and a wall surface of each of the plurality of positioning holes after heating the plurality of conductive bumps.

### Claim 8 (depends on 6)

The method of claim 6, wherein each of the plurality of conductive bumps includes a conductive pillar used to bond to each of the plurality of second electrode pads and a conductive bonding material formed on the conductive pillar.

### Claim 9 (depends on 8)

The method of claim 8, wherein the conductive bonding material is a solder material.

### Claim 10 (depends on 6)

The method of claim 6, wherein a material for forming the positioning layer is an organic insulating material.