# US 2025/0096167 A1 · Antenna Apparatus and Method

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- Number: US 2025/0096167 A1
- Document ID: US20250096167A1
- Status: Published application
- Kind: A1
- Application number: 18/969,430
- Filed: 2024-12-05
- Published: 2025-03-20
- Earliest claimed: 2021-02-26
- Assignees: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicants: Taiwan Semiconductor Manufacturing Co., Ltd.
- Inventors: Feng-Wei Kuo; Wen-Shiang Liao
- Web page: https://patentgrep.com/patent/US20250096167A1

## CPC

- H10W 44/20: at high-frequency [HF] or radio frequency [RF]
- H01Q 1/2283: {mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package}
- H01Q 1/241: {used in mobile communications, e.g. GSM (H01Q1/247, H01Q1/248 take precedence)}
- H01Q 9/0407: {Substantially flat resonant element parallel to ground plane, e.g. patch antenna (dipole H01Q9/285; monopole H01Q9/40)}
- H01Q 21/28: Combinations of substantially independent non-interacting antenna units or systems {(multiple beam H01Q25/00)}
- H10W 70/05: of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04)
- H10W 70/09: extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs
- H10W 70/099: {Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers}
- H10W 70/611: {for connecting multiple chips together}
- H10W 70/614: {the multiple chips being integrally enclosed}
- H10W 70/65: Shapes or dispositions of interconnections
- H10W 70/685: comprising multiple insulating layers
- H10W 80/00: Direct bonding of chips, wafers or substrates
- H10W 90/00: Package configurations
- H10W 44/248: {for antennas}
- H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40)
- H10W 70/6528: {of the portions that connect to chips, wafers or package parts}
- H10W 72/241: {Dispositions, e.g. layouts}
- H10W 72/823: {Interconnections through encapsulations, e.g. pillars through molded resin on a lateral side a chip}
- H10W 72/853: {On the same surface}
- H10W 72/874: {On different surfaces}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 72/926: {Multiple bond pads having different sizes}
- H10W 72/9413: {on encapsulations}
- H10W 72/944: {Dispositions of multiple bond pads}
- H10W 90/10: Configurations of laterally-adjacent chips
- H10W 90/28: the stacked chips having different sizes, e.g. chip stacks having a pyramidal shape
- H10W 90/401: {characterised by multiple insulating or insulated package substrates, interposers or RDLs}
- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- H10W 90/722: {between stacked chips}
- H10W 90/732: {between stacked chips}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/792: {between multiple chips}
- H10W 99/00: Subject matter not provided for in other groups of this subclass
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72)

## Abstract

A package structure includes a first die, a second die over and electrically connected to the first die, an insulating material around the second die, a first antenna extending through the insulating material and electrically connected to the second die, the first antenna being adjacent to a first sidewall of the second die, wherein the first antenna includes a first conductive plate extending through the insulating material, and a plurality of first conductive pillars extending through the insulating material, wherein the first conductive plate is between the plurality of first conductive pillars and the first sidewall of the second die.

## Claims

### Claim 1

A package structure comprising:
a first die over and bonded to a second die;
an insulating material over the second die and around the first die;
a first antenna adjacent to a first sidewall of the first die, the first antenna extending through the insulating material, and wherein the first antenna comprises:
a first conductive plate over the second die, the first conductive plate extending through the insulating material, the first conductive plate being electrically connected to the first die by a corresponding first feed line; and
a plurality of first conductive pillars over the second die, the plurality of first conductive pillars extending through the insulating material, wherein the first conductive plate is disposed between the plurality of first conductive pillars and the first sidewall of the second die.

### Claim 2 (depends on 1)

The package structure of claim 1, wherein the insulating material comprises silicon oxide.

### Claim 3 (depends on 2)

The package structure of claim 2, wherein the dielectric constant of the insulating material is in a range from 3.9 to 4.2.

### Claim 4 (depends on 1)

The package structure of claim 1, further comprising:
a redistribution structure over the insulating material, the first die, the plurality of first conductive pillars, and the first conductive plate; and
first conductive connectors over the redistribution structure, the first conductive connectors being electrically connected to the plurality of first conductive pillars through the redistribution structure.

### Claim 5 (depends on 4)

The package structure of claim 4, further comprising second conductive connectors over the redistribution structure, the second conductive connectors being electrically connected to the second die through the first die and the first feed line.

### Claim 6 (depends on 1)

The package structure of claim 1, further comprising:
a second antenna adjacent to a second sidewall of the first die, the second antenna extending through the insulating material, and wherein the second antenna comprises:
a second conductive plate over the second die, the second conductive plate extending through the insulating material, the second conductive plate being electrically connected to the first die by a corresponding second feed line; and
a plurality of second conductive pillars over the second die, the plurality of second conductive pillars extending through the insulating material, wherein the second conductive plate is disposed between the plurality of second conductive pillars and the second sidewall of the second die.

### Claim 7 (depends on 6)

The package structure of claim 6, wherein the first sidewall and the second sidewall are parallel to each other.

### Claim 8 (depends on 6)

The package structure of claim 6, wherein the first sidewall and the second sidewall are perpendicular to each other.

### Claim 9

A package structure comprising:
a bottom die;
a first die and a second die over and bonded to the bottom die;
an insulating material around each of the first die and the second die;
a first antenna over the bottom die, the first antenna extending through the insulating material, the first antenna being adjacent to a first sidewall of the first die; and
a second antenna over the bottom die, the second antenna extending through the insulating material, the second antenna being adjacent to a first sidewall of the second die, wherein the first die and the second die are disposed between the first antenna and the second antenna.

### Claim 10 (depends on 9)

The package structure of claim 9, wherein the first sidewall of the first die and the first sidewall of the second die are parallel to each other.

### Claim 11 (depends on 10)

The package structure of claim 10, further comprising:
a third antenna over the bottom die, the third antenna extending through the insulating material, the third antenna being adjacent to a second sidewall of the first die; and
a fourth antenna over the bottom die, the fourth antenna extending through the insulating material, the fourth antenna being adjacent to a second sidewall of the second die.

### Claim 12 (depends on 11)

The package structure of claim 11, wherein the second sidewall of the first die and the second sidewall of the second die are parallel to each other.

### Claim 13 (depends on 12)

The package structure of claim 12, wherein the second sidewall of the first die and the second sidewall of the second die are perpendicular to the first sidewall of the first die and the first sidewall of the second die.

### Claim 14 (depends on 9)

The package structure of claim 9, wherein each of the first antenna and the second antenna comprises:
a conductive plate extending through the insulating material; and
a plurality of conductive pillars extending through the insulating material.

### Claim 15 (depends on 9)

The package structure of claim 9, wherein each of the first antenna and the second antenna comprises:
a conductive plate extending through the insulating material; and
a conductive mesh extending through the insulating material.

### Claim 16

A package comprising:
a first package structure adjacent to and electrically connected to a first die using a redistribution structure, wherein the first package structure and the first die are disposed over the redistribution structure, wherein the first package structure comprises:
a second die over and bonded to a third die;
an insulating material over the third die and encapsulating the second die; and
a first antenna adjacent a first sidewall of the second die, the first antenna extending through the insulating material; and
a package substrate coupled to the redistribution structure using first conductive connectors.

### Claim 17 (depends on 16)

The package of claim 16, further comprising a second antenna adjacent a second sidewall of the second die, the second antenna extending through the insulating material.

### Claim 18 (depends on 17)

The package of claim 17, wherein the first sidewall of the second die and the second sidewall of the second die are parallel to each other.

### Claim 19 (depends on 17)

The package of claim 17, wherein the first sidewall of the second die and the second sidewall of the second die are perpendicular to each other.

### Claim 20 (depends on 16)

The package of claim 16, wherein the first antenna comprises:
a conductive plate extending through the insulating material; and
a plurality of conductive pillars extending through the insulating material.