# US 2025/0096166 A1 · Radio-frequency module and communication device

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 2025/0096166 A1
- Document ID: US20250096166A1
- Status: Published application
- Kind: A1
- Application number: 18/966,416
- Filed: 2024-12-03
- Published: 2025-03-20
- Earliest claimed: 2019-07-03
- Assignees: Murata Manufacturing Co., Ltd.
- Applicants: Murata Manufacturing Co., Ltd.
- Inventors: Hiromichi KITAJIMA
- Web page: https://patentgrep.com/patent/US20250096166A1

## CPC

- H10W 44/20: at high-frequency [HF] or radio frequency [RF]
- H01Q 1/2283: {mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package}
- H04B 1/034: Portable transmitters
- H04B 1/38: Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H05K 1/18: structurally associated with non-printed electric components (H05K1/16 takes precedence)
- H10W 90/00: Package configurations
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72)
- H04B: TRANSMISSION
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

To reduce the height in a thickness direction of a mounting substrate. A radio-frequency module includes a mounting substrate, an electronic component, first and second chip components. The electronic component is mounted on a first main surface of the mounting substrate. The first and second chip components are mounted on a second main surface of the mounting substrate. Each of the first and second chip components includes a substrate and a circuit portion. The substrate has first and second main surfaces facing each other. The circuit portion is formed on the first main surface side of the substrate. The second main surface of the substrate in each of the first and second chip components is exposed. A material of the substrate in the first chip component is the same as a material of the substrate in the second chip component.

## Claims

### Claim 1

A radio-frequency module comprising:
a mounting substrate having a first main surface and a second main surface on opposite sides of the mounting substrate;
a power amplifier mounted on the first main surface of the mounting substrate;
a transmission filter connected to the power amplifier and mounted on the first main surface of the mounting substrate;
a first chip component including a first switch connected to the transmission filter and mounted on the second main surface of the mounting substrate;
a second chip component including a low-noise amplifier connected to the first switch and mounted on the second main surface of the mounting substrate; and
an external connection terminal connected to a ground and overlapping the power amplifier in a plan view of the mounting substrate;
wherein the first chip component and the second chip component each include a substrate having a first main substrate surface and a second main substrate surface on opposite sides of the substrate, and
wherein the second main substrate surface of the substrate in each of the first chip component and the second chip component and a tip surface of the external connection terminal are coplanar with each other.

### Claim 2 (depends on 1)

The radio-frequency module according to claim 1, wherein the substrate of each of the first chip component and the second chip component is a silicon substrate.

### Claim 3 (depends on 2)

The radio-frequency module according to claim 2, further comprising:
a reception filter connected to the low-noise amplifier and mounted on the first main surface of the mounting substrate.

### Claim 4

A radio-frequency module comprising:
a mounting substrate having a first main surface and a second main surface on opposite sides of the mounting substrate;
a power amplifier mounted on the first main surface of the mounting substrate;
a transmission filter connected to the power amplifier and mounted on the first main surface of the mounting substrate;
a first chip component including a first switch connected to the transmission filter and mounted on the second main surface of the mounting substrate;
a second chip component including a second switch connected to the power amplifier and mounted on the second main surface of the mounting substrate;
a third chip component including a low-noise amplifier connected to the first switch and mounted on the second main surface of the mounting substrate; and
an external connection terminal connected to a ground and overlapping the power amplifier in a plan view of the mounting substrate;
wherein the first chip component, the second chip component, and the third chip component each include a substrate having a first main substrate surface and a second main substrate surface on opposite sides of the substrate, and
wherein the second main substrate surface of the substrate in each of the first chip component, the second chip component, and the third chip component and a tip surface of the external connection terminal are coplanar with each other.

### Claim 5 (depends on 4)

The radio-frequency module according to claim 4, wherein the substrate of each of the first chip component, the second chip component, and the third chip component is a silicon substrate.

### Claim 6 (depends on 5)

The radio-frequency module according to claim 5, further comprising:
a reception filter connected to the low-noise amplifier and mounted on the first main surface of the mounting substrate.

### Claim 7

A radio-frequency module comprising:
a mounting substrate having a first main surface and a second main surface on opposite sides of the mounting substrate;
a power amplifier mounted on the first main surface of the mounting substrate;
a reception filter mounted on the first main surface of the mounting substrate;
a first chip component including a first switch connected to the power amplifier and mounted on the second main surface of the mounting substrate;
a second chip component including a low-noise amplifier connected to the reception filter and the first switch and mounted on the second main surface of the mounting substrate; and
an external connection terminal connected to a ground and overlapping the power amplifier in a plan view of the mounting substrate;
wherein the first chip component and the second chip component each include a substrate having a first main substrate surface and a second main substrate surface on opposite sides of the substrate, and
wherein the second main substrate surface of the substrate in each of the first chip component and the second chip component and a tip surface of the external connection terminal are coplanar with each other.

### Claim 8 (depends on 7)

The radio-frequency module according to claim 7, wherein the substrate of each of the first chip component and the second chip component is a silicon substrate.

### Claim 9 (depends on 8)

The radio-frequency module according to claim 8, further comprising:
a transmission filter connected to the power amplifier and mounted on the first main surface of the mounting substrate.

### Claim 10 (depends on 1)

A communication device comprising:
the radio-frequency module according to claim 1; and
a signal processing circuit that performs signal processing on a reception signal from an antenna and a transmission signal to the antenna, wherein
the radio-frequency module is configured to transmit the reception signal and the transmission signal between the antenna and the signal processing circuit.