# US 2025/0096157 A1 · Semiconductor package > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2025/0096157 A1 - Document ID: US20250096157A1 - Status: Published application - Kind: A1 - Application number: 18/651,891 - Filed: 2024-05-01 - Published: 2025-03-20 - Earliest claimed: 2023-09-14 - Assignees: Samsung Electronics Co., Ltd. - Applicants: Samsung Electronics Co., Ltd. - Inventors: Kangjoon Lee - Web page: https://patentgrep.com/patent/US20250096157A1 ## CPC - H10W 42/121: {protecting against mechanical damage (H10W76/00, H10W74/00 take precedence)} - H10W 70/611: {for connecting multiple chips together} - H10W 70/65: Shapes or dispositions of interconnections - H10W 76/40: Fillings or auxiliary members in containers, e.g. centering rings (fillings or auxiliary members for thermal protection or control in containers or encapsulations H10W40/70) - H10W 90/00: Package configurations - H10W 90/401: {characterised by multiple insulating or insulated package substrates, interposers or RDLs} - H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts} - H10W 74/117: {the substrate having spherical bumps for external connection} - H10W 90/297: {characterised by the through-semiconductor vias [TSVs] in the stacked chips} - H10W 90/722: {between stacked chips} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A semiconductor package includes a package substrate, a package body disposed on an upper surface of the package substrate, and a stiffener disposed at each of four sides of the package substrate, wherein the stiffener includes a horizontal part covering the upper surface of the package substrate at the four sides of the package substrate and a vertical part extending downward from the horizontal part in a vertical direction substantially perpendicular to the upper surface of the package substrate at four corners of the package substrate, and the vertical part protrudes in the vertical direction from a lower surface of the package substrate. ## Claims ### Claim 1 A semiconductor package comprising: a package substrate; a package body disposed on an upper surface of the package substrate; and a stiffener disposed at sides of the package substrate, wherein the stiffener comprises a horizontal part disposed on the upper surface of the package substrate at the sides of the package substrate and a vertical part extending downward from the horizontal part in a vertical direction substantially perpendicular to the upper surface of the package substrate at corners of the package substrate, and the vertical part protrudes in the vertical direction from a lower surface of the package substrate. ### Claim 2 (depends on 1) The semiconductor package of claim 1, wherein the sides of the package substrate include a first side and a third side opposite to each other and extend in a first direction substantially parallel to the upper surface of the package substrate, and a second side and a fourth side opposite to each other and extend in a second direction substantially perpendicular to the first direction and substantially parallel to the upper surface of the package substrate. ### Claim 3 (depends on 2) The semiconductor package of claim 2, wherein the vertical part is disposed at end portions of each of the second side and the fourth side of the package substrate in the second direction. ### Claim 4 (depends on 2) The semiconductor package of claim 2, wherein the vertical part is disposed at each corner of the package substrate formed between the first side, the second side, the third side, and the fourth side of the package substrate, and on the first side, the second side, the third side, and the fourth side of the package substrate. ### Claim 5 (depends on 2) The semiconductor package of claim 2, wherein the vertical part is disposed at a center portion of each of the second side and the fourth side of the package substrate. ### Claim 6 (depends on 2) The semiconductor package of claim 2, wherein the vertical part is disposed at end portions of each of the second side and the fourth side of the package substrate in the second direction and at center portions of each of the second side and the fourth side of the package substrate. ### Claim 7 (depends on 1) The semiconductor package of claim 1, further comprising an external connection terminal disposed on the lower surface of the package substrate, wherein a first length of the vertical part in the vertical direction from the lower surface of the package substrate is within a range of about 39% to about 43% of a height of the external connection terminal, and the height of the external connection terminal is a length downward from the lower surface of the package substrate in the vertical direction. ### Claim 8 (depends on 1) The semiconductor package of claim 1, further comprising an external connection terminal disposed on a lower surface of the package substrate, the package substrate is mounted on a board of an external electronic device through the external connection terminal, and a lower surface of the vertical part contacts an upper surface of an outer portion of the board. ### Claim 9 (depends on 1) The semiconductor package of claim 1, wherein the package body comprises a single semiconductor chip, or a chip stack portion having a structure where a plurality of semiconductor chips are stacked. ### Claim 10 (depends on 1) The semiconductor package of claim 1, further comprising a passive device disposed on the package substrate between the package body and the stiffener. ### Claim 11 A semiconductor package comprising: a package substrate having a tetragonal shape; a package body disposed on an upper surface of the package substrate; a stiffener disposed at sides of the package substrate; and an external connection terminal disposed on a lower surface of the package substrate, wherein a first side and a third side of the package substrate are opposite to each other and extend in a first direction parallel to the upper surface of the package substrate, a second side and a fourth side of the package substrate are opposite to each other and extend in a second direction perpendicular to the first direction and parallel to the upper surface of the package substrate, the stiffener comprises a horizontal part disposed on the upper surface of the package substrate at the sides of the package substrate and a plurality of vertical parts extending downward from the horizontal part in a vertical direction perpendicular to the upper surface of the package substrate at corners of the package substrate formed by the first side, the second side, the third side, and the fourth side, and the plurality of vertical parts protrude from the lower surface of the package substrate in the vertical direction and a protrusion length of the plurality of vertical parts has a range of about 39% to about 43% of a height of the external connection terminal with respect to the lower surface of the package substrate. ### Claim 12 (depends on 11) The semiconductor package of claim 11, wherein the plurality of vertical parts are disposed at end portions of each of the second side and the fourth side of the package substrate in the second direction. ### Claim 13 (depends on 11) The semiconductor package of claim 11, wherein the plurality of vertical parts are disposed at the first side, the second side, the third side, and the fourth side of the package substrate. ### Claim 14 (depends on 11) The semiconductor package of claim 11, wherein the plurality of vertical parts extend in the second direction at the second side and the fourth side of the package substrate. ### Claim 15 (depends on 11) The semiconductor package of claim 11, wherein the package body comprises a single semiconductor chip or a chip stack portion having a structure where a plurality of semiconductor chips are stacked. ### Claim 16 A semiconductor package comprising: an external board; a package substrate disposed on the external board and having a tetragonal shape including four sides; a package body disposed at a center portion of an upper surface of the package substrate; a stiffener disposed at each of the four sides of the package substrate; and an external connection terminal disposed between a lower surface of the package substrate and the external board, wherein a first side and a third side of the four sides of the package substrate are opposite to each other and extend in a first direction parallel to the upper surface of the package substrate, a second side and a fourth side of the four sides of the package substrate are opposite to each other and extend in a second direction perpendicular to the first direction and parallel to the upper surface of the package substrate, the stiffener comprises a horizontal part disposed on the upper surface of the package substrate at the four sides of the package substrate and a vertical part extending downward from the horizontal part in a vertical direction perpendicular to the upper surface of the package substrate at four corners of the package substrate, the external board has a warpage shape where a center portion is disposed away from the package substrate in the first direction, and the vertical part protrudes by a first length in the vertical direction from a lower surface of the package substrate and contacts an upper surface of the external board in the first direction. ### Claim 17 (depends on 16) The semiconductor package of claim 16, wherein the first length is within a range of about 39% to about 43% of a height of the external connection terminal. ### Claim 18 (depends on 16) The semiconductor package of claim 16, wherein the vertical part is disposed at end portions of each of the second side and the fourth side of the package substrate in the second direction, or is disposed at each corner of the package substrate formed between the first side, the second side, the third side, and the fourth side of the package substrate, and on the first side, the second side, the third side, and the fourth side of the package substrate. ### Claim 19 (depends on 16) The semiconductor package of claim 16, wherein the vertical part extends in the second direction at each of the second side and the fourth side of the package substrate and contacts an upper surface of the external board at four sides thereof. ### Claim 20 (depends on 16) The semiconductor package of claim 16, wherein the package body comprises a single semiconductor chip or a chip stack portion has a structure where a plurality of semiconductor chips are stacked.