# US 2025/0096154 A1 · Package Substrates with Stiffener Interposers > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2025/0096154 A1 - Document ID: US20250096154A1 - Status: Published application - Kind: A1 - Application number: 18/466,844 - Filed: 2023-09-14 - Published: 2025-03-20 - Earliest claimed: 2023-09-14 - Assignees: Intel Corporation - Applicants: Intel Corporation - Inventors: Chin Mian CHOONG; Jiun Hann SIR; Poh Boon KHOO; Juha PAAVOLA - Web page: https://patentgrep.com/patent/US20250096154A1 ## CPC - H10W 42/121: {protecting against mechanical damage (H10W76/00, H10W74/00 take precedence)} - H10W 76/40: Fillings or auxiliary members in containers, e.g. centering rings (fillings or auxiliary members for thermal protection or control in containers or encapsulations H10W40/70) - H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons - H10W 70/05: of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04) - H10W 70/095: {of vias therein} - H10W 70/099: {Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers} - H10W 70/65: Shapes or dispositions of interconnections - H10W 70/685: comprising multiple insulating layers - H10W 70/692: Ceramics or glasses - H10W 90/401: {characterised by multiple insulating or insulated package substrates, interposers or RDLs} - H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract The present disclosure is directed to a stiffener having a first lateral member and a vertical member that form a frame structure that encloses around a package substrate of a semiconductor package, and the vertical member having an upper end connected to the first lateral member and a lower end extending downward from the first lateral member for connecting to a printed circuit board. ## Claims ### Claim 1 A device comprising: a first lateral member and a vertical member, wherein the first lateral member and the vertical member form a frame structure that encloses a package substrate of a semiconductor package; and the vertical member having an upper end connected to the first lateral member and a lower end extending downward from the first lateral member for connecting to a printed circuit board. ### Claim 2 (depends on 1) The device of claim 1, wherein the frame structure is formed by the first lateral member and the vertical member has an L-shaped cross-section. ### Claim 3 (depends on 1) The device of claim 1, further comprising a second lateral member, wherein the second lateral member extends horizontally from the lower end of the vertical member. ### Claim 4 (depends on 3) The device of claim 3, wherein the second lateral member extends horizontally inward within a vertical footprint of the first lateral member. ### Claim 5 (depends on 4) The device of claim 4, wherein the frame structure formed by the first lateral member, the vertical member, and the second lateral member has a U-shaped cross-section. ### Claim 6 (depends on 3) The device of claim 3, wherein the second lateral member extends horizontally outward to extend a vertical footprint of the frame structure. ### Claim 7 (depends on 6) The device of claim 6, wherein the frame structure formed by the first lateral member, the vertical member, and the second lateral member has a zig-zag-shaped cross-section. ### Claim 8 (depends on 3) The device of claim 3, wherein each of the first lateral member, the vertical member, and the second lateral member have metallization layers and vias to provide electrical pathways between the semiconductor package and the printed circuit board. ### Claim 9 (depends on 1) The device of claim 1, wherein the frame structure comprises a ceramic material. ### Claim 10 (depends on 1) The device of claim 1, wherein the frame structure comprises an assembled structure made from several subcomponents. ### Claim 11 A method comprising: forming a stiffener, wherein the stiffener comprises a first lateral member and a vertical member; providing a package substrate for a semiconductor package, wherein the package substrate comprises a top surface, side surfaces, and a bottom surface; disposing at least one semiconductor die onto the top surface of the package substrate to form the semiconductor package; and disposing the stiffener on the package substrate, wherein the first lateral member is disposed on the top surface and the vertical member is disposed proximally to the side surfaces of the package substrate. ### Claim 12 (depends on 11) The method of claim 11, further comprising disposing a solder ball grid array on the semiconductor package. ### Claim 13 (depends on 12) The method of claim 12, further comprising disposing the semiconductor package on a printed circuit board and coupling the semiconductor package and the stiffener to the printed circuit board. ### Claim 14 (depends on 11) The method of claim 11, wherein forming the stiffener comprises: providing ceramic sheets; stacking and laminating the ceramic sheets; dicing the ceramic sheets to form the stiffener into a desired shape; and sintering the stiffener. ### Claim 15 (depends on 14) The method of claim 14, wherein forming the stiffener further comprises: forming the vias and metallization layers in the ceramic sheets using a screen printing process; and stacking the ceramic sheets having the vias and metallization layers to form laminated structures before dicing the ceramic sheets to form the stiffener in a desired shape. ### Claim 16 An electronic component comprising: a semiconductor package comprising a package substrate having a periphery; a plurality of solder balls attached to the package substrate; a frame structure enclosing the periphery of the package substrate and the plurality of solder balls; and a printed circuit board, wherein the frame structure and the plurality of solder balls are attached to the printed circuit board. ### Claim 17 (depends on 16) The electronic component of claim 16, wherein the package substrate comprises a thin core substrate or coreless substrate. ### Claim 18 (depends on 16) The electronic component of claim 16, wherein the frame structure comprises vias and metallization layers that provide an electrical bridge between the semiconductor package and the printed circuit board. ### Claim 19 (depends on 16) The electronic component of claim 16, wherein the frame structure comprises a ceramic material. ### Claim 20 (depends on 16) The electronic component of claim 16, wherein the frame structure comprises an assembled structure made from several subcomponents.