# US 2025/0096145 A1 · Electronic packaging structure

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 2025/0096145 A1
- Document ID: US20250096145A1
- Status: Published application
- Kind: A1
- Application number: 18/964,695
- Filed: 2024-12-02
- Published: 2025-03-20
- Earliest claimed: 2021-06-22
- Assignees: Unimicron Technology Corp.
- Applicants: Unimicron Technology Corp.
- Inventors: Chin-Sheng Wang; Ra-Min Tain; Chih-Kai Chan; Chun-Hsien Chien
- Web page: https://patentgrep.com/patent/US20250096145A1

## CPC

- H10W 70/611: {for connecting multiple chips together}
- H10W 40/25: characterised by their materials
- H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
- H10W 44/20: at high-frequency [HF] or radio frequency [RF]
- H10W 70/614: {the multiple chips being integrally enclosed}
- H10W 70/635: {Through-vias}
- H10W 70/68: Shapes or dispositions thereof
- H10W 70/685: comprising multiple insulating layers
- H10W 90/00: Package configurations
- H10W 90/401: {characterised by multiple insulating or insulated package substrates, interposers or RDLs}
- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- H10W 44/209: {Vertical interconnections, e.g. vias}
- H10W 44/212: {Coaxial feed-throughs in substrates}
- H10W 44/248: {for antennas}
- H10W 72/00: Interconnections or connectors in packages
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

An electronic packaging structure including a first circuit structure and a second circuit structure is provided. An electronic component is disposed between the first circuit structure and the second circuit structure. At least one of the first circuit structure and the second circuit structure (for example, the second circuit structure) has a cavity. The electronic component is embedded in the cavity, and may be encapsulated between the first circuit structure and the second circuit structure.

## Claims

### Claim 1

An electronic packaging structure, comprising:
a first circuit structure;
a second circuit structure; and
a first electronic component located between the first circuit structure and the second circuit structure,
wherein at least one of the first circuit structure and the second circuit structure has a cavity, and the first electronic component is embedded in the cavity.

### Claim 2 (depends on 1)

The electronic packaging structure according to claim 1, wherein the second circuit structure further comprises a conductive core layer.

### Claim 3 (depends on 1)

The electronic packaging structure according to claim 1, further comprising:
a thermal interface material filled in the cavity and in contact with the first electronic component.

### Claim 4 (depends on 1)

The electronic packaging structure according to claim 1, further comprising:
a second electronic component disposed on a bottom surface of the second circuit structure.

### Claim 5 (depends on 1)

The electronic packaging structure according to claim 1, wherein the first circuit structure comprises a first redistribution layer;
the second circuit structure comprises a second redistribution layer; and
the first redistribution layer and the second redistribution layer face a same side of the electronic packaging structure.

### Claim 6 (depends on 1)

The electronic packaging structure according to claim 1, further comprising:
a conductive connecting component located between the first circuit structure and the second circuit structure and electrically connecting the first circuit structure and the second circuit structure.

### Claim 7 (depends on 1)

The electronic packaging structure according to claim 1, wherein the first circuit structure comprises a coaxial conductive via, and the coaxial conductive via comprises:
an inner conductive layer;
an outer conductive layer; and
a first dielectric layer located between the inner conductive layer and the outer conductive layer.

### Claim 8 (depends on 7)

The electronic packaging structure according to claim 7, wherein the outer conductive layer is grounded.

### Claim 9 (depends on 7)

The electronic packaging structure according to claim 7, wherein the coaxial conductive via further comprises a second dielectric layer, and the inner conductive layer is located between the first dielectric layer and the second dielectric layer.

### Claim 10 (depends on 7)

The electronic packaging structure according to claim 7, wherein the first circuit structure further comprises a first sub-structure and a second sub-structure electrically connected to the first sub-structure, wherein the first sub-structure comprises the coaxial conductive via, and the second sub-structure comprises a first redistribution layer.