# US 2025/0096084 A1 · Integrated stacked substrate for isolated power module > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2025/0096084 A1 - Document ID: US20250096084A1 - Status: Published application - Kind: A1 - Application number: 18/471,223 - Filed: 2023-09-20 - Published: 2025-03-20 - Earliest claimed: 2023-09-20 - Applicants: Texas Instruments Incorporated - Inventors: Vijaylaxmi Khanolkar; Yi Yan - Web page: https://patentgrep.com/patent/US20250096084A1 ## CPC - H10W 70/461: {specially adapted for cooling} - H10W 70/411: {Chip-supporting parts, e.g. die pads} - H10W 70/415: {Leadframe inner leads serving as die pads} - H10W 70/417: {Bonding materials between chips and die pads} - H10W 72/30: Die-attach connectors - H10W 90/00: Package configurations - H10W 90/811: {Multiple chips on leadframes} - H10W 70/429: {being the outer leads} - H10W 72/07353: {changes in shapes} - H10W 72/07354: {changes in dispositions} - H10W 72/07554: {changes in dispositions} - H10W 72/332: {Plan-view shape, i.e. in top view} - H10W 72/348: {Top-view layouts, e.g. mirror arrays} - H10W 72/865: {Die-attach connectors and bond wires} - H10W 72/884: {Die-attach connectors and bond wires} - H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10W 90/751: {of bond wires} - H10W 90/752: {between stacked chips} - H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A microelectronic device includes a die pad having a first surface and a second, opposite, surface. A first component is directly attached to the first surface of the die pad through a first thermally conductive material. A second component is directly attached to the second surface of the die pad through a second thermally conductive material. At least a portion of the second component overlaps at least a portion of the first component. The microelectronic device further includes a first thermal shunt connecting the die pad to a first lead, and a second thermal shunt connecting the die pad to a second lead. The first thermal shunt is closer to a center of the first component than to a center of the second component. The second thermal shunt is closer to a center of the second component than to a center of the first component. ## Claims ### Claim 1 A microelectronic device, comprising: a die pad having a first surface and a second surface opposite from the first surface, the die pad being electrically conductive; a first component directly attached to the first surface of the die pad through a first thermally conductive material; a second component directly attached to the second surface of the die pad through a second thermally conductive material, wherein at least a portion of the second component overlaps at least a portion of the first component; leads extending to an exterior of the microelectronic device, the leads being electrically conductive; a first thermal shunt connecting the die pad to a first lead of the leads, the first thermal shunt being electrically conductive, wherein the first thermal shunt is closer to a center of the first component than to a center of the second component; and a second thermal shunt connecting the die pad to a second lead of the leads, the second thermal shunt being electrically conductive, wherein the second thermal shunt is closer to the center of the second component than to the center of the first component. ### Claim 2 (depends on 1) The microelectronic device of claim 1, wherein the die pad is a first die pad, and further including: a second die pad having a third surface and a fourth surface opposite from the third surface, the second die pad being electrically conductive, wherein the first component is directly attached to the third surface of the second die pad through a third thermally conductive material; and a third thermal shunt connecting the second die pad to a third lead of the leads, the third thermal shunt being electrically conductive, wherein the third thermal shunt is closer to the center of the first component than to the center of the second component. ### Claim 3 (depends on 2) The microelectronic device of claim 2, further including: a third component directly attached to the fourth surface of the second die pad through a fourth thermally conductive material, wherein at least a portion of the third component overlaps at least a portion of the first component; and a fourth thermal shunt connecting the second die pad to a fourth lead of the leads, the fourth thermal shunt being electrically conductive, wherein the fourth thermal shunt is closer to a center of the third component than to the center of the first component. ### Claim 4 (depends on 1) The microelectronic device of claim 1, further including an additional component attached to the first component. ### Claim 5 (depends on 1) The microelectronic device of claim 1, wherein the die pad, the first thermal shunt, the second thermal shunt, and the leads are elements of a lead frame. ### Claim 6 A method of forming a microelectronic device, comprising: providing a lead frame having a die pad, leads, a first thermal shunt connecting the die pad to a first lead of the leads, and a second thermal shunt connecting the die pad to a second lead of the leads; attaching a first component to a first surface of the die pad through a first thermally conductive material; and attaching a second component to a second surface of the die pad, opposite from the first surface, through a second thermally conductive material; wherein: the die pad, the leads, the first thermal shunt, and the second thermal shunt are electrically conductive; at least a portion of the second component overlaps at least a portion of the first component; the first thermal shunt is closer to a center of the first component than to a center of the second component; and the second thermal shunt is closer to a center of the second component than to a center of the first component. ### Claim 7 (depends on 6) The method of claim 6, wherein: the die pad is a first die pad; the lead frame includes a second die pad having a third surface and a fourth surface opposite from the third surface; and the lead frame includes a third thermal shunt connecting the second die pad to a third lead of the leads; and further including attaching the first component to the third surface of the die pad through a third thermally conductive material; wherein: the second die pad is electrically conductive; the third thermal shunt is electrically conductive; and the third thermal shunt is closer to the center of the first component than to the center of the second component. ### Claim 8 (depends on 7) The method of claim 7, wherein the lead frame includes a fourth thermal shunt connecting the second die pad to a fourth lead of the leads, the fourth thermal shunt being electrically conductive; and further including attaching a third component directly to the fourth surface of the second die pad through a fourth thermally conductive material, at least a portion of the third component overlapping at least a portion of the first component, wherein the fourth thermal shunt is closer to a center of the third component than to a center of the first component. ### Claim 9 (depends on 6) The method of claim 6, further including attaching an additional component to the first component. ### Claim 10 (depends on 6) The method of claim 6, wherein attaching the first component to the die pad is performed prior to attaching the second component to the die pad. ### Claim 11 A microelectronic device, comprising: a first die pad having a first surface and a second surface opposite from the first surface, the first die pad being electrically conductive; a first component directly attached to the first surface of the first die pad through a first thermally conductive material; a second die pad having a third surface and a fourth surface opposite from the third surface, the third surface being coplanar with the first surface of the first die pad and the fourth surface being coplanar with the second surface of the first die pad, the second die pad being electrically conductive; a second component directly attached to the fourth surface of the second die pad through a second thermally conductive material, wherein at least a portion of the second component overlaps at least a portion of the first component; leads extending to an exterior of the microelectronic device, the leads being electrically conductive; a first thermal shunt connecting the first die pad to a first lead of the leads, the first thermal shunt being electrically conductive; and a second thermal shunt connecting the second die pad to a second lead of the leads, the second thermal shunt being electrically conductive. ### Claim 12 (depends on 11) The microelectronic device of claim 11, further including: a third die pad having a fifth surface and a sixth surface opposite from the fifth surface, the fifth surface being coplanar with the first surface of the first die pad and the sixth surface being coplanar with the second surface of the first die pad, the third die pad being electrically conductive, wherein the first component is directly attached to the fifth surface of the third die pad through a third thermally conductive material; and a third thermal shunt connecting the third die pad to a third lead of the leads, the third thermal shunt being electrically conductive. ### Claim 13 (depends on 12) The microelectronic device of claim 12, further including: a fourth die pad having a seventh surface and an eighth surface opposite from the seventh surface, the seventh surface being coplanar with the first surface of the first die pad and the eighth surface being coplanar with the second surface of the first die pad, the fourth die pad being electrically conductive; a third component directly attached to the seventh surface of the fourth die pad through a fourth thermally conductive material, wherein at least a portion of the third component overlaps at least a portion of the first component; and a fourth thermal shunt connecting the fourth die pad to a fourth lead of the leads, the fourth thermal shunt being electrically conductive. ### Claim 14 (depends on 11) The microelectronic device of claim 11, further including a component attached to the first component. ### Claim 15 (depends on 11) The microelectronic device of claim 11, wherein the first die pad, the second die pad, the first thermal shunt, the second thermal shunt, and the leads are elements of a lead frame. ### Claim 16 A method of forming a microelectronic device, comprising: providing a lead frame having a first die pad, a second die pad, leads, a first thermal shunt connecting the first die pad to a first lead of the leads, and a second thermal shunt connecting the second die pad to a second lead of the leads; wherein: the leads, the first and second die pads, and the first and second thermal shunts are electrically conductive; the first die pad has a first surface and a second surface opposite from the first surface; and the second die pad has a third surface coplanar with the first surface of the first die pad and a fourth surface opposite from the first surface, the fourth surface being coplanar with the second surface of the first die pad; attaching a first component to the first surface of the first die pad through a first thermally conductive material; and attaching a second component to the fourth surface of the second die pad through a second thermally conductive material, wherein at least a portion of the second component overlaps at least a portion of the first component. ### Claim 17 (depends on 16) The method of claim 16, wherein: the lead frame includes a third die pad having a fifth surface and a sixth surface opposite from the fifth surface, the fifth surface being coplanar with the first surface of the first die pad, the third die pad being electrically conductive; and the lead frame includes a third thermal shunt connecting the third die pad to a third lead of the leads, the third thermal shunt being electrically conductive; and further including attaching the first component directly to the fifth surface of the third die pad through a third thermally conductive material. ### Claim 18 (depends on 17) The method of claim 17, wherein the lead frame includes a fourth die pad having a seventh surface and an eighth surface opposite from the seventh surface, the seventh surface being coplanar with the first surface of the first die pad and the eighth surface being coplanar with the second surface of the first die pad, the fourth die pad being electrically conductive, and the lead frame includes a fourth thermal shunt connecting the fourth die pad to a fourth lead of the leads, the fourth thermal shunt being electrically conductive; and further including attaching a third component directly to the seventh surface of the fourth die pad through a fourth thermally conductive material, wherein at least a portion of the third component overlaps at least a portion of the first component. ### Claim 19 (depends on 16) The method of claim 16, further including directly attaching an additional component to the first component. ### Claim 20 (depends on 16) The method of claim 16, wherein attaching the first component to the first die pad is performed prior to attaching the second component to the second die pad.