# US 2025/0096079 A1 · Semiconductor Device and Inverter Provided With Semiconductor Device

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- Number: US 2025/0096079 A1
- Document ID: US20250096079A1
- Status: Published application
- Kind: A1
- Application number: 18/729,353
- Filed: 2022-12-27
- Published: 2025-03-20
- Earliest claimed: 2022-01-20
- Assignees: Hitachi Astemo, Ltd.
- Applicants: Hitachi Astemo, Ltd.
- Inventors: Masahiro SEO; Takeshi TOKUYAMA; Takashi ISHII
- Web page: https://patentgrep.com/patent/US20250096079A1

## CPC

- H10W 70/468: {Circuit boards}
- H02M 7/003: {Constructional details, e.g. physical layout, assembly, wiring or busbar connections}
- H02M 7/48: using discharge tubes with control electrode or semiconductor devices with control electrode
- H10W 90/00: Package configurations
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H02M: APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF (transformers H01F; dynamo-electric converters H02K47/00; controlling transformers, reactors or choke coils, control or regulation of electric motors, generators or dynamo-electric converters H02P)

## Abstract

In this semiconductor device and the inverter provided with the semiconductor device, an upper arm semiconductor element on a positive electrode wiring plate and an AC wiring plate are connected to each other by a first wiring member, and a lower arm semiconductor element on the AC wiring plate and a negative electrode wiring plate are connected to each other by a second wiring member. The AC wiring plate has: a first region to which the first wiring member is to be connected; a second region in which the lower arm semiconductor element is to be provided; and a connection region that connects these two regions. The connection region is positioned opposite positive-electrode/negative-electrode terminals with a region in between where the first and second wiring members are used, and the placement order is as follows: the positive electrode wiring plate, the negative electrode wiring plate, the first region, and the second region.

## Claims

### Claim 1

A semiconductor device provided in an inverter, the semiconductor device comprising:
a positive electrode wiring board provided with a positive electrode terminal;
a negative electrode wiring board provided with a negative electrode terminal; and
an alternating-current wiring board provided with an alternating-current terminal, on an insulation layer of a substrate included in the semiconductor device,
wherein the positive electrode wiring board has a plurality of upper arm semiconductor elements electrically connected in parallel,
the alternating-current wiring board has a plurality of lower arm semiconductor elements electrically connected in parallel,
the plurality of upper arm semiconductor elements and the alternating-current wiring board being electrically connected to each other by first wiring members, respectively, and
the plurality of lower arm semiconductor elements and the negative electrode wiring board being electrically connected to each other by second wiring members, respectively,
the alternating-current wiring board has a first region to which the first wiring members are connected, a second region in which the plurality of lower arm semiconductor elements are provided, and a connection region that connects the first region and the second region,
the connection region being provided at a position opposite to the positive electrode terminal and the negative electrode terminal with a region in between where the first wiring member connects the positive electrode wiring board and the first region and a region in between where the second wiring member connects the negative electrode wiring board and the second region, and
the positive electrode wiring board, the negative electrode wiring board, the first region, and the second region are arranged on the insulation layer in the order of the positive electrode wiring board, the negative electrode wiring board, the first region, and the second region.

### Claim 2 (depends on 1)

The semiconductor device according to claim 1, wherein the first wiring members and the second wiring members are alternately arranged.

### Claim 3 (depends on 1)

The semiconductor device according to claim 1, wherein
the first wiring member is longer as the first wiring member is closer to the connection region, and
the second wiring member is longer as the second wiring member is closer to the negative electrode terminal.

### Claim 4 (depends on 1)

An Inverter comprising the semiconductor devices according to claim 1,
wherein the semiconductor devices are arranged side by side in parallel with a short-dimension direction of the semiconductor device, and are connected to a direct-current voltage input terminal via a smoothing capacitor element.