# US 2025/0096071 A1 · Integrated circuit cooling systems and methods > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2025/0096071 A1 - Document ID: US20250096071A1 - Status: Published application - Kind: A1 - Application number: 18/467,979 - Filed: 2023-09-15 - Published: 2025-03-20 - Earliest claimed: 2023-09-15 - Assignees: Taiwan Semiconductor Manufacturing Company, Ltd. - Applicants: Taiwan Semiconductor Manufacturing Company, Ltd. - Inventors: Tsunyen Wu; Po-Yao Lin; Sing-Da Jiang; Shih-Wei Liu; Kathy Yan - Web page: https://patentgrep.com/patent/US20250096071A1 ## CPC - H10W 40/613: {for stacked arrangements of a plurality of semiconductor devices} - H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections - H10W 40/30: wherein the packaged device is completely immersed in a fluid other than air, e.g. immersed in a cryogenic fluid - H10W 40/611: {Bolts or screws} - H10W 90/00: Package configurations - H10W 40/231: {characterised by their places of attachment or cooling paths} - H10W 40/60: Securing means for detachable heating or cooling arrangements, e.g. clamps - H10W 72/877: {Bump connectors and die-attach connectors} - H10W 90/722: {between stacked chips} - H10W 90/731: {of die-attach connectors} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract Provided are integrated circuit systems and methods for fabricating semiconductor packages. An integrated circuit system includes a circuit board having a top side and a bottom side and defining an opening from the top side to the bottom side; a bottom boiling plate having a recessed portion and having a projection with a terminal surface, wherein the recessed portion is located below the bottom side of the circuit board, wherein the projection extends through the opening, and wherein the terminal surface is located above the top side of the circuit board; a semiconductor substrate located over the top side of the circuit board and including semiconductor devices; and a top boiling plate located over the semiconductor substrate, wherein the bottom boiling plate and the top boiling plate are configured to dissipate heat away from the integrated circuit system. ## Claims ### Claim 1 An integrated circuit system comprising: a circuit board having a top side and a bottom side and defining an opening from the top side to the bottom side; a bottom boiling plate having a recessed portion and having a projection with a terminal surface, wherein the recessed portion is located below the bottom side of the circuit board, wherein the projection extends through the opening, and wherein the terminal surface is located above the top side of the circuit board; a semiconductor substrate located over the top side of the circuit board and including semiconductor devices; and a top boiling plate located over the semiconductor substrate, wherein the bottom boiling plate and the top boiling plate are configured to dissipate heat away from the integrated circuit system. ### Claim 2 (depends on 1) The integrated circuit system of claim 1, wherein the semiconductor substrate has a back side facing the terminal surface of the bottom boiling plate and a front side, wherein the semiconductor devices are formed on the front side. ### Claim 3 (depends on 2) The integrated circuit system of claim 2, further comprising a voltage regulator module (VRM) on the back side of the semiconductor substrate and electrically connected to at least one of the semiconductor devices. ### Claim 4 (depends on 3) The integrated circuit system of claim 3, further comprising a thermal interface material (TIM) contacting the terminal surface of the bottom boiling plate and the VRM. ### Claim 5 (depends on 2) The integrated circuit system of claim 2, further comprising a connector electrically connecting the semiconductor devices to the circuit board, wherein the connector is located between the top side of the circuit board and the back side of the semiconductor substrate. ### Claim 6 (depends on 1) The integrated circuit system of claim 1, wherein the semiconductor substrate has a back side facing the terminal surface of the bottom boiling plate and a front side, wherein the semiconductor devices are formed on dies, and wherein the dies are located on the front side of the semiconductor substrate. ### Claim 7 (depends on 6) The integrated circuit system of claim 6, further comprising a thermal interface material (TIM) contacting the dies and the top boiling plate. ### Claim 8 (depends on 1) The integrated circuit system of claim 1, further comprising: a top bolt coupling the top boiling plate to the circuit board; and a bottom bolt coupling the bottom boiling plate to the circuit board. ### Claim 9 (depends on 1) The integrated circuit system of claim 1, further comprising a ring enclosing an outer periphery of the semiconductor substrate, wherein: the top boiling plate has base portion and a sag portion; the ring terminates at an uppermost surface located below the base portion of the top boiling plate; and the sag portion of the top boiling plate is surrounded by the ring. ### Claim 10 An integrated circuit system comprising: a circuit board having a top side and a bottom side and defining an opening from the top side to the bottom side; a semiconductor substrate having a front side and a back side, located over the top side of the circuit board, and including semiconductor devices on the front side; a voltage regulator module (VRM) on the back side of the semiconductor substrate and electrically connected to at least one of the semiconductor devices; a bottom thermally conductive member extending through the opening in the circuit board and in thermal communication with the VRM to dissipate heat away from the back side of the semiconductor substrate. ### Claim 11 (depends on 10) The integrated circuit system of claim 10, wherein: the bottom thermally conductive member includes a recessed portion and has a projection with a terminal surface; the recessed portion is located below the bottom side of the circuit board; the projection extends through the opening; the terminal surface is located above the top side of the circuit board; the terminal surface is in thermal communication with the VRM. ### Claim 12 (depends on 11) The integrated circuit system of claim 11, further comprising a thermal interface material interconnecting the terminal surface and the VRM. ### Claim 13 (depends on 10) The integrated circuit system of claim 10, further comprising: a top thermally conductive member located over the front side of the semiconductor substrate, wherein the top thermally conductive member is in thermal communication with the semiconductor devices to dissipate heat away from the front side of the semiconductor substrate. ### Claim 14 (depends on 13) The integrated circuit system of claim 13, further comprising a thermal interface material interconnecting the top thermally conductive member and the semiconductor devices. ### Claim 15 A method for fabricating a semiconductor package, the method comprising: forming an integrated circuit over a front side of a substrate; forming a voltage regulator module (VRM) on the back side of the substrate, wherein the VRM is electrically connected to the integrated circuit; thermally connecting the VRM to a bottom thermally conductive member; and thermally connecting the integrated circuit to a top thermally conductive member. ### Claim 16 (depends on 15) The method of claim 15, wherein: the bottom thermally conductive member is a bottom boiling plate; and the top thermally conductive member is a top boiling plate. ### Claim 17 (depends on 15) The method of claim 15, further comprising electrically connecting the integrated circuit to a circuit board, wherein the circuit board includes an opening, and wherein thermally connecting the VRM to the bottom thermally conductive member comprises inserting a portion of the bottom thermally conductive member through the opening. ### Claim 18 (depends on 17) The method of claim 17, wherein electrically connecting the integrated circuit to the circuit board comprises electrically connecting the integrated circuit to the circuit board via a ring defining a gap, and wherein thermally connecting the VRM to the bottom thermally conductive member comprises inserting the portion of the bottom thermally conductive member into the gap. ### Claim 19 (depends on 17) The method of claim 17, further comprising: structurally mounting the bottom thermally conductive member to the circuit board; and structurally mounting the top thermally conductive member to the circuit board. ### Claim 20 (depends on 15) The method of claim 15, further comprising: forming a top thermal interface material (TIM) layer over the integrated circuit, wherein thermally connecting the integrated circuit to the top thermally conductive member comprises connecting the top thermally conductive member to the top TIM layer; and forming a bottom thermal interface material (TIM) layer over the VRM, wherein thermally connecting the VRM to the bottom thermally conductive member comprises connecting the bottom thermally conductive member to the bottom TIM layer.