# US 2025/0096015 A1 · Resin sealing device and resin sealing method > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2025/0096015 A1 - Document ID: US20250096015A1 - Status: Published application - Kind: A1 - Application number: 18/728,897 - Filed: 2023-04-18 - Published: 2025-03-20 - Earliest claimed: 2022-06-08 - Assignees: Apic Yamada Corporation - Applicants: Apic Yamada Corporation - Inventors: Shusaku Tagami; Makoto Yanagisawa - Web page: https://patentgrep.com/patent/US20250096015A1 ## CPC - H10P 72/0441: {Apparatus for sealing, encapsulating, glassing, decapsulating or the like} - B29C 43/18: incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles {(B29C43/206 takes precedence)} - B29C 43/34: Feeding the material to the mould or the compression means {(B29C43/085 takes precedence)} - H10W 74/01: Manufacture or treatment - H10W 74/014: {using batch processing} - H10W 74/016: {using moulds} - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A resin sealing device (1) includes: a resin sealing mold (21), configured to seal an electronic component (P) with resin by compression molding a resin material on a workpiece (W); and a resin amount calculation portion (79), configured to calculate a resin amount of the resin material to be supplied to the workpiece (W) for each workpiece based on a mounting state of the electronic component (P) in the workpiece (W). The resin material includes a first resin (R1) and a second resin (R2), the first resin (R1) is a sheet-like resin, and the second resin (R2) is a granulated resin, a powdered resin, or a liquid resin. A supply amount of at least the second resin (R2) among the first resin (R1) and the second resin (R2) is determined for each workpiece based on the resin amount calculated by the resin amount calculation portion (79). ## Claims ### Claim 1 A resin sealing device, which is a compression molding type resin sealing device configured to seal an electronic component of a workpiece comprising a substrate and the electronic component with resin, the resin sealing device comprising: a resin sealing mold, configured to seal the electronic component with resin by compression molding a resin material on the workpiece; and a resin amount calculation portion, configured to calculate, for each workpiece, a resin amount of the resin material to be supplied to the workpiece based on a mounting state of the electronic component in the workpiece, wherein the resin material comprises a first resin and a second resin, the first resin is a sheet-like resin, the second resin is a granulated resin, a powdered resin, or a liquid resin, and a supply amount of at least the second resin among the first resin and the second resin is determined for each workpiece based on the resin amount calculated by the resin amount calculation portion. ### Claim 2 (depends on 1) The resin sealing device according to claim 1, wherein the second resin is a resin having identical or different properties as the first resin. ### Claim 3 (depends on 1) The resin sealing device according to claim 1, further comprising: a first resin supply portion, configured to supply the first resin; and a second resin supply portion, configured to supply the second resin, wherein the second resin supply portion is configured to supply the second resin into an opening of a guide portion on the first resin supplied by the first resin supply portion. ### Claim 4 (depends on 3) The resin sealing device according to claim 3, wherein the resin sealing mold comprises an upper mold and a lower mold, and the upper mold has a cavity recessed portion opening toward the lower mold. ### Claim 5 (depends on 4) The resin sealing device according to claim 4, further comprising: a loader hand, configured to transport the resin material to the resin sealing mold, wherein the second resin has a higher releasability than the first resin, and the loader hand is configured to provide the first resin and the second resin in the cavity recessed portion with the second resin facing the upper mold. ### Claim 6 (depends on 3) The resin sealing device according to claim 3, wherein the resin sealing mold comprises an upper mold and a lower mold, and the lower mold has a cavity recessed portion opening toward the upper mold. ### Claim 7 (depends on 6) The resin sealing device according to claim 6, further comprising: a loader hand, configured to transport the resin material to the resin sealing mold, wherein the first resin has a higher releasability than the second resin, and the loader hand is configured to provide the first resin and the second resin in the cavity recessed portion with the first resin facing the lower mold. ### Claim 8 (depends on 1) The resin sealing device according to claim 1, further comprising: a first resin supply portion, configured to supply the first resin; and a second resin supply portion, configured to supply the second resin, wherein the second resin supply portion is configured to supply the second resin into an opening of a guide portion, and the first resin supply portion is configured to supply the first resin on the second resin. ### Claim 9 (depends on 8) The resin sealing device according to claim 8, further comprising: a loader hand, configured to transport the resin material to the resin sealing mold, wherein the loader hand has a suction pad or an electrostatic chuck. ### Claim 10 (depends on 1) The resin sealing device according to claim 1, further comprising: a loader hand, configured to transport the resin material to the resin sealing mold, wherein the loader hand is configured to transport the first resin and the second resin to the resin sealing mold in a state in which the first resin and the second resin are fused together. ### Claim 11 (depends on 1) The resin sealing device according to claim 1, wherein a supply amount of the second resin is determined based on a difference between the resin amount calculated by the resin amount calculation portion and a supply amount of the first resin. ### Claim 12 (depends on 1) The resin sealing device according to claim 1, wherein a supply amount of the second resin is smaller than a supply amount of the first resin. ### Claim 13 A resin sealing method, which is a compression molding type resin sealing method for sealing an electronic component of a workpiece comprising a substrate and the electronic component with resin, the resin sealing method comprising: calculating, for each workpiece, a resin amount of a resin material to be supplied to the workpiece based on a mounting state of the electronic component in the workpiece; supplying the workpiece to a resin sealing mold; supplying a resin material to the resin sealing mold; and sealing the electronic component with resin by compression molding the resin material on the workpiece by the resin sealing mold, wherein the resin material comprises a first resin and a second resin, the first resin is a sheet-like resin, the second resin is a granulated resin, a powdered resin, or a liquid resin, and a supply amount of at least the second resin among the first resin and the second resin is determined for each workpiece based on the resin amount of the resin material calculated for each workpiece.