# US 2025/0093599 A1 · Optical module assembly > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2025/0093599 A1 - Document ID: US20250093599A1 - Status: Published application - Kind: A1 - Application number: 18/883,663 - Filed: 2024-09-12 - Published: 2025-03-20 - Earliest claimed: 2023-09-20 - Assignees: Electronics and Telecommunications Research Institute - Applicants: Electronics and Telecommunications Research Institute - Inventors: Won-Bae KWON; Eun Kyu KANG; Jong Jin LEE; Soo Yong JUNG; Haechung KANG; Sangjin KWON; Myunghwan KIM - Web page: https://patentgrep.com/patent/US20250093599A1 ## CPC - G02B 6/428: {containing printed circuit boards [PCB]} - G02B 6/4281: {the printed circuit boards being flexible (in general H05K1/147)} - G02B 6/4246: {Bidirectionally operating package structures} - G02B 6/4251: {Sealed packages (G02B6/4248 takes precedence)} - G02B 6/4267: {Reduction of thermal stress, e.g. by selecting thermal coefficient of materials} - G02B 6/4269: {with heat sinks or radiation fins} - G02B 6/4278: {related to pluggable or demountable opto-electronic or electronic elements} - G02B 6/4279: {Radio frequency signal propagation aspects of the electrical connection, high frequency adaptations} - G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS ## Abstract An optical module assembly is provided. The optical module assembly includes an electric sub-assembly including a printed circuit board (PCB) and an electronic device mounted on the PCB and an optical module including an interposer including a transparent material, an optical sub-assembly accommodating optical components, and a cover covering an upper portion of the optical sub-assembly, wherein one end portion of the PCB is inserted into the optical sub-assembly through an inserting hole formed in a sidewall of the optical sub-assembly, and the optical components and a substrate electrode formed on a surface of the one end portion of the PCB are electrically connected to each other by the interposer. ## Claims ### Claim 1 An optical module assembly comprising: an electric sub-assembly including a printed circuit board (PCB) and an electronic device mounted on the PCB; and an optical module including an interposer including a transparent material, an optical sub-assembly accommodating optical components, and a cover covering an upper portion of the optical sub-assembly, wherein one end portion of the PCB is inserted into the optical sub-assembly through an inserting hole formed in a sidewall of the optical sub-assembly, and the optical components and a substrate electrode formed on a surface of the one end portion of the PCB are electrically connected to each other by the interposer. ### Claim 2 (depends on 1) The optical module assembly of claim 1, wherein the optical components are mounted on the interposer. ### Claim 3 (depends on 1) The optical module assembly of claim 1, wherein the optical component is electrically connected to the substrate electrode by a through via passing through the interposer and an electrode pattern patterned at an inner portion and a surface of the interposer. ### Claim 4 (depends on 1) The optical module assembly of claim 1, wherein the interposer comprises: a first interposer disposed on an optical module mount formed on an inner bottom surface of the optical sub-assembly; and a second interposer disposed on the first interposer, and a ground pattern with the optical components mounted thereon and a high-speed transmission line electrically connected to the optical components by a bonding wire are patterned on an upper surface of the second interposer. ### Claim 5 (depends on 4) The optical module assembly of claim 4, wherein the optical components are electrically connected to the substrate electrode by two through vias passing through the second interposer and an electrode pattern which electrically connects the two through vias with each other and is formed between the first interposer and the second interposer. ### Claim 6 (depends on 4) The optical module assembly of claim 4, wherein the optical components are electrically connected to the substrate electrode by two through vias passing through all of the first interposer and the second interposer and an electrode pattern which electrically connects the two through vias with each other and is formed on a lower surface of the first interposer. ### Claim 7 (depends on 4) The optical module assembly of claim 4, wherein the optical module mount comprises a mount portion protruding in an upward direction from a surface of the optical module mount, a portion of the second interposer being provided on the optical module mount, and the second interposer comprises a radiating via for transferring heat, occurring in the optical components, to the mount portion. ### Claim 8 (depends on 7) The optical module assembly of claim 7, wherein the optical module mount and the mount portion are provided as one body, and heat occurring in the optical components are transferred to the optical sub-assembly through the optical mount module including the mount portion and the radiating via. ### Claim 9 (depends on 8) The optical module assembly of claim 8, wherein the optical module mount and the optical sub-assembly comprise a material which is good in heat transfer characteristic, for smoothly dissipating heat occurring in the optical components to the outside, and the material comprises one of aluminum oxide (Al2O3), a copper-tungsten (CuW) alloy, silicon (Si), and a composition of at least two materials thereof. ### Claim 10 (depends on 1) The optical module assembly of claim 1, wherein an opening portion is formed in a bottom surface of the optical sub-assembly, so as to align positions of an electrode of the interposer and the substrate electrode of the PCB with eyes, and the PCB and the interposer are bonded to a solder bump melted by a high power laser passing through the opening portion. ### Claim 11 (depends on 10) The optical module assembly of claim 10, further comprising a sealant for sealing the opening portion when bonding between the PCB and the interposer is completed. ### Claim 12 (depends on 11) The optical module assembly of claim 11, wherein the sealant comprises an epoxy-based material.