# US 2025/0093594 A1 · Semiconductor package including photonic integrated circuit chip > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2025/0093594 A1 - Document ID: US20250093594A1 - Status: Published application - Kind: A1 - Application number: 18/747,906 - Filed: 2024-06-19 - Published: 2025-03-20 - Earliest claimed: 2023-09-15 - Assignees: Samsung Electronics Co., Ltd. - Applicants: Samsung Electronics Co., Ltd. - Inventors: Junghoon Kang; Daegon Kim - Web page: https://patentgrep.com/patent/US20250093594A1 ## CPC - G02B 6/4231: {with intermediate elements, e.g. rods and balls, between the elements} - G02B 6/30: for use between fibre and thin-film device - G02B 6/4243: {Mounting of the optical light guide into a groove (mounting optical light guides into a groove in general G02B6/3636)} - G02B 6/428: {containing printed circuit boards [PCB]} - H10F 39/10: Integrated devices - H10W 20/20: Interconnections within wafers or substrates, e.g. through-silicon vias [TSV] - H10W 70/611: {for connecting multiple chips together} - H10W 70/68: Shapes or dispositions thereof - H10W 70/685: comprising multiple insulating layers - H10W 90/00: Package configurations - H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts} - H10W 90/722: {between stacked chips} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/794: {between a chip and a stacked insulating package substrate, interposer or RDL} - G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A semiconductor package includes a package substrate including an alignment hole extending inwardly from a side surface of the package substrate, a photonic integrated circuit chip disposed on the package substrate, the of the package substrate chip including a groove extending inwardly from a side surface of the PIC chip and a photo-electron conversion unit including an edge coupler, and an optical fiber connector including a frame, an optical fiber mounted in the groove of the of the package substrate chip and passing through the frame, and an alignment pin extending from the frame to an inside of the alignment hole, wherein the edge coupler is located at one end of the photo-electron conversion unit. ## Claims ### Claim 1 A semiconductor package comprising: a package substrate including an alignment hole extending inwardly from a side surface of the package substrate; a photonic integrated circuit chip disposed on the package substrate, the photonic integrated circuit chip including a groove extending inwardly from a side surface of the photonic integrated circuit chip, and a photo-electron conversion unit including an edge coupler; and an optical fiber connector including a frame, an optical fiber mounted in the groove of the photonic integrated circuit chip and passing through the frame, and an alignment pin extending from the frame to an inside of the alignment hole, wherein the edge coupler is located at one end of the photo-electron conversion unit. ### Claim 2 (depends on 1) The semiconductor package of claim 1, wherein the edge coupler of the photo-electron conversion unit of the photonic integrated circuit chip has a constant thickness and faces the optical fiber. ### Claim 3 (depends on 1) The semiconductor package of claim 1, wherein: the optical fiber includes a core layer and a clad layer covering the core layer, and a vertical level of a vertical center of the core layer of the optical fiber in the groove is equal to a vertical level of a vertical center of the edge coupler. ### Claim 4 (depends on 1) The semiconductor package of claim 1, wherein a side surface of the frame of the optical fiber connector faces a side surface of the photonic integrated circuit chip in which the groove is located and faces a side surface of the package substrate in which the alignment hole is located. ### Claim 5 (depends on 4) The semiconductor package of claim 4, wherein a sidewall of the groove facing the side surface of the frame and farthest from the side surface of the frame of the optical fiber connector is closer to the frame of the optical fiber connector than a sidewall of the alignment hole facing the side surface of the frame and farthest from the frame of the optical fiber connector. ### Claim 6 (depends on 1) The semiconductor package of claim 1, wherein: the optical fiber and the alignment pin extend from a first side surface of the frame, and a horizontal length in a first horizontal direction from the first side surface of the frame to an end of the optical fiber located in the groove is less than a horizontal length in the first horizontal direction from the first side surface of the frame to the end of the alignment pin located in the alignment hole. ### Claim 7 (depends on 1) The semiconductor package of claim 1, wherein the alignment hole of the package substrate is apart from upper and lower surfaces of the package substrate. ### Claim 8 (depends on 1) The semiconductor package of claim 1, wherein the alignment pin includes a plurality of regions having different areas when viewed from a cross-section perpendicular to a direction in which the alignment pin extends. ### Claim 9 (depends on 1) The semiconductor package of claim 1, wherein: the photonic integrated circuit chip includes a plurality of through-vias. ### Claim 10 A semiconductor package comprising: a package substrate including at least a first alignment hole extending inwardly from a side surface of the package substrate; a photonic integrated circuit chip disposed on the package substrate, the photonic integrated circuit chip including a groove extending inwardly from a side surface of the photonic integrated circuit chip and a photo-electron converter including a plurality of terminal end couplers; a semiconductor chip disposed on the package substrate; and an optical fiber connector including a frame, a plurality of optical fibers penetrating through the frame, and at least a first alignment pin extending from the frame to an inside of the first alignment hole, wherein the plurality of terminal end couplers are located at a first end of the photo-electron converter. ### Claim 11 (depends on 10) The semiconductor package of claim 10, wherein each of the plurality of optical fibers of the optical fiber connector is configured to input/output an optical signal having multiple wavelengths from/to one of the plurality of terminal end couplers of the photonic integrated circuit chip. ### Claim 12 (depends on 11) The semiconductor package of claim 11, wherein the plurality of optical fibers of the optical fiber connector are configured to input/output optical signals having different wavelengths from/to the photonic integrated circuit chip. ### Claim 13 (depends on 10) The semiconductor package of claim 10, further comprising: a second alignment pin of the optical fiber connector, wherein the first alignment pin is apart from the second alignment pin are apart in a horizontal direction. ### Claim 14 (depends on 13) The semiconductor package of claim 13, wherein a distance between the first alignment pin and the second alignment pin is greater than a horizontal width of the photonic integrated circuit chip. ### Claim 15 (depends on 10) The semiconductor package of claim 10, further comprising: a second alignment pin of the optical fiber connector, wherein the first alignment pin overlaps the second alignment pin in a vertical direction. ### Claim 16 A semiconductor package comprising: a package substrate including at least a first alignment hole extending inwardly from a side surface of the package substrate; a photonic integrated circuit chip disposed on the package substrate, the photonic integrated circuit chip including a groove extending inwardly from a side surface of the photonic integrated circuit chip and a photo-electron converter including a plurality of terminal end couplers; a semiconductor chip disposed on the package substrate; an electronic integrated circuit chip disposed on an upper surface of the photonic integrated circuit chip; and an optical fiber connector including a frame, a plurality of optical fibers penetrating through the frame and mounted in the groove, and at least a first alignment pin extending from the frame to an inside of the first alignment hole, wherein the plurality of terminal end couplers are located at one end of the photo-electron converter, and wherein the first alignment hole of the package substrate is apart from upper and lower surfaces of the package substrate. ### Claim 17 (depends on 16) The semiconductor package of claim 16, wherein: a side surface of the photonic integrated circuit chip in which a groove is located faces the same direction as a side surface of the package substrate in which the first alignment hole is located, and an length of the groove in the extension direction of the groove is shorter than a length of the first alignment hole in the extension direction of the first alignment hole. ### Claim 18 (depends on 16) The semiconductor package of claim 16, wherein the first alignment pin of the optical fiber connector includes a region in which a thickness decreases along an axial direction of the first alignment pin. ### Claim 19 (depends on 16) The semiconductor package of claim 16, further comprising: a second alignment pin of the optical fiber connector, wherein the first alignment pin is apart from the second alignment pin in at least one of a vertical direction and a horizontal direction.