# US 2025/0093115 A1 · Cooling system assembly > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2025/0093115 A1 - Document ID: US20250093115A1 - Status: Published application - Kind: A1 - Application number: 18/822,215 - Filed: 2024-09-01 - Published: 2025-03-20 - Earliest claimed: 2023-09-20 - Assignees: Purple Cloud Development Pte. Ltd. - Applicants: Purple Cloud Development Pte. Ltd. - Inventors: Chia-chin Chan - Web page: https://patentgrep.com/patent/US20250093115A1 ## CPC - F24F 7/06: with forced air circulation, e.g. by fan {positioning of a ventilator in or against a conduit} - H05K 7/20254: {Cold plates transferring heat from heat source to coolant} - F17D 1/08: for liquids or viscous products (water-main or service pipe systems E03B7/04; domestic hot-water supply systems F24D17/00) - F28D 1/03: with plate-like or laminated conduits {(stacked plates having one or more openings therein to form tubular heat-exchange passages F28F3/086)} - F28D 15/0275: {Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores} - H05K 7/20336: {Heat pipes, e.g. wicks or capillary pumps} - F28D 2021/0029: {Heat sinks} - F28D 2021/0031: {Radiators for recooling a coolant of cooling systems} - F28F 1/325: {Fins with openings} - F24F: AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING (removing dirt or fumes from areas where they are produced B08B15/00; vertical ducts for carrying away waste gases from buildings E04F17/02; tops for chimneys or ventilating shafts, terminals for flues F23L17/02) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - F17D: PIPE-LINE SYSTEMS; PIPE-LINES (pumps or compressors F04; fluid dynamics F15D; valves or the like F16K; pipes, laying pipes, supports, joints, branches, repairing, work on the entire line, accessories F16L; steam traps or the like F16T; fluid-pressure electric cables H01B9/06) - F28D: HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT (fluid heaters having heat generating means and heat transferring means F24H; furnaces F27; details of heat-exchange apparatus of general) - F28F: DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION (water and air traps, air venting F16) ## Abstract A cooling system assembly may include a water block unit and liquid cooling unit. The water block unit is configured for phase-change of a first cooling fluid and the liquid cooling unit is configured to be flow through by a second cooling fluid. The water block unit includes a first thermal transfer surface and second thermal transfer surface. The first thermal transfer surface is configured to couple to a packaged integrated circuit. The liquid cooling unit includes a liquid plate heat exchanger comprising a liquid cooling water block coupled to the second thermal transfer surface. The first thermal transfer surface is thermally coupled to the packaged integrated circuit, whereby the water block unit transports heat away from the packaged integrated circuit. The liquid cooling water block is thermally coupled to the second thermal transfer surface, whereby the liquid cooling unit transports heat away from the water block unit. ## Claims ### Claim 1 A cooling system assembly, comprising: a water block unit configured for phase-change of a first cooling fluid, including a water block comprising a first thermal transfer surface and a second thermal transfer surface, the second thermal transfer surface opposite the first thermal transfer surface, the first thermal transfer surface configured to couple to at least one packaged integrated circuit; and a liquid cooling unit configured to be flow through by a second cooling fluid, including a liquid plate heat exchanger comprising a liquid cooling water block, the liquid cooling water block coupled to the second thermal transfer surface; wherein the first thermal transfer surface is thermally coupled to the at least one packaged integrated circuit, whereby the water block unit transports heat away from the at least one packaged integrated circuit, and wherein the liquid cooling water block is thermally coupled to the second thermal transfer surface, whereby the liquid cooling unit transports heat away from the water block unit. ### Claim 2 (depends on 1) The cooling system assembly of claim 1, wherein the water block unit further comprises a fin stack and a plurality of heat pipes, each plurality of heat pipes respectively coupled to the water block on one end and each plurality of heat pipes respectively coupled to the fin stack on an other end, the other end opposite the one end. ### Claim 3 (depends on 2) The cooling system assembly of claim 2, wherein the plurality of heat pipes comprises five plurality of heat pipes. ### Claim 4 (depends on 2) The cooling system assembly of claim 2, wherein the fin stack is disposed on one side of the water block unit. ### Claim 5 (depends on 2) The cooling system assembly of claim 2, wherein the water block unit further comprises a fan unit coupled to the fin stack, the fan unit configured to force air across the fin stack. ### Claim 6 (depends on 5) The cooling system assembly of claim 5, wherein the fan unit comprises more than one rotatable fan. ### Claim 7 (depends on 2) The cooling system assembly of claim 2, further comprising a circuit board assembly including a circuit board, and wherein the water block further comprises a plurality of attachment hubs protruding from the water block, and wherein the liquid plate heat exchanger comprises a plurality of counterbores, each plurality of counterbores aligns with and receives each plurality of attachment hubs, the liquid cooling unit configured to couple to the water block unit via a plurality of attachment members, each plurality of attachment members fasten the liquid cooling unit to the water block unit via the plurality of counterbores and the plurality of attachment hubs, the liquid cooling unit and the water block unit are coupled to the circuit board. ### Claim 8 (depends on 7) The cooling system assembly of claim 7, wherein the circuit board further comprises a socket, a plurality of electronic components, and a plurality of leads, the at least one packaged integrated circuit electrically coupled to the circuit board via the socket, the plurality of electronic components electrically coupled to the circuit board via the plurality of leads. ### Claim 9 (depends on 8) The cooling system assembly of claim 8, wherein the fin stack comprises an elongated fin stack, the elongated fin stack disposed on the plurality of electronic components, the elongated fin stack configured to thermally couple to the plurality of electronic components. ### Claim 10 (depends on 8) The cooling system assembly of claim 8, wherein the plurality of electronic components comprises stacked inductor and transistor electronic components. ### Claim 11 (depends on 1) The cooling system assembly of claim 1, wherein the at least one packaged integrated circuit comprises a graphic processing unit. ### Claim 12 (depends on 1) The cooling system assembly of claim 1, wherein the liquid cooling unit further comprises a liquid row heat sink, an inlet manifold, an outlet manifold, an inlet tubing, and an outlet tubing, the liquid plate heat exchanger is in fluid communication with the inlet manifold via the inlet tubing, the liquid plate heat exchanger is in fluid communication with the outlet manifold via the outlet tubing, the liquid row heat sink is configured to lower a flowthrough temperature of ambient airflow flowing through the liquid row heat sink via the second cooling fluid flowing through the liquid row heat sink from the inlet manifold to the outlet manifold. ### Claim 13 (depends on 12) The cooling system assembly of claim 12, wherein the liquid cooling unit further comprises a pump unit, the pump unit disposed within the liquid plate heat exchanger or coupled to the outlet tubing between the liquid plate heat exchanger and the outlet manifold. ### Claim 14 (depends on 12) The cooling system assembly of claim 12, wherein the liquid row heat sink is a water-cooled heat sink row. ### Claim 15 (depends on 12) The cooling system assembly of claim 12, wherein the liquid cooling unit further comprises a liquid cooling fan unit coupled to the liquid row heat sink, the liquid cooling fan unit configured to force air across the liquid row heat sink. ### Claim 16 (depends on 15) The cooling system assembly of claim 15, wherein the liquid cooling fan unit comprises more than one rotatable fan. ### Claim 17 (depends on 1) The cooling system assembly of claim 1, wherein the water block unit further comprises a first fin stack, a second fin stack, and a plurality of heat pipes, each plurality of heat pipes respectively coupled to the first fin stack on one end, each plurality of heat pipes respectively coupled to the second fin stack on an other end, the other end opposite the one end, each plurality of heat pipes respectively coupled to the water block between the first fin stack and the second fin stack. ### Claim 18 (depends on 17) The cooling system assembly of claim 17, wherein the water block unit further comprises a first fan unit coupled to the first fin stack and a second fan unit coupled to the second fin stack, the first fan unit and the second fan unit respectfully configured to force air across the first fin stack and the second fin stack. ### Claim 19 (depends on 17) The cooling system assembly of claim 17, wherein the plurality of heat pipes comprises five plurality of heat pipes. ### Claim 20 (depends on 17) The cooling system assembly of claim 17, wherein the first fin stack is disposed on one side of the water block unit and the second fin stack is disposed on an other side of the water block unit, the other side opposite the one side.