Method for producing an adhesive composition for optical irradiation peeling

A method for producing an adhesive composition for use in debonding with light irradiation, the method comprising:

• mixing a component (A) that can be cured through hydrosilylation, the component (A) comprising:
• a polysiloxane (A1);
• a component (B) that contains at least one species selected from the group consisting of a component containing an epoxy-modified polyorganosiloxane, a component containing a methyl-group-containing polyorganosiloxane, and a component containing a phenyl-group-containing polyorganosiloxane;
• carbon black;
• and
• a solvent;
• and
• obtaining an adhesive composition which composition can achieve debonding through irradiation with light;
• wherein:
• each of the component (A) and the component (B) has no silanol group;
• the polysiloxane (A1) comprises:
• a polyorganosiloxane (a1) having an alkenyl group, and
• a polyorganosiloxane (a2) having a Si—H group;
• a carbon black content is 4 to 13 parts by mass with respect to 100 parts by mass of an entire amount of the adhesive component;
• and
• a solvent content is 10 to 90 mass % with respect to an entire amount of the adhesive composition.