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US 2025/0092185 A1Published application
Improved Structural Bonding Adhesive
AssigneeZephyros, Inc.
InventorsDavid Kosal, Michael Czaplicki, Yuan Lu
Life of this patent
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Abstract
A material comprising an epoxy/elastomer adduct, a polymeric particle, from about 0.05 to about 20 weight percent of an epoxy/diacid adduct, and optionally, an amine reaction product.
Claims26
A material comprising:
- i) at least two different epoxy/elastomer adducts;
- ii) a phenoxy resin dissolved in a bisphenol F epoxy;
- iii) from about 0.05 to about 20 weight percent of an epoxy/diacid adduct;
- and
- iv) a silane modified epoxy resin.
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Dependencies are inferred from the claim text.